CMOS-Based Microsensors

2006 IEEE Instrumentation and Measurement Technology Conference Proceedings

2006

A new CMOS compatible thermopile was designed and fabricated with high fill factor, the floating membrane of the thermopile which we designed was formed by T-shape anisotropic etching window that never be proposed before. The design and fabrication of thermopile sensors are realized by using 1.2 µm CMOS IC technology combined with a subsequent anisotropic frontside etching. Four etching windows with minimum T-shape were opened by the CMOS processes, and then by using N 2 H 4 etching solution the silicon substrate was etched along <100> directions. The T-shape etching windows which proposed in this paper are designed at four quadrant of membrane to form the extended undercut etching area of opened windows of overlap. The floating membrane has a larger area of 1100×1100µm 2 and 2 µm thick. Therefore, the area of proposed membrane is increased greatly which absorbs more infrared radiation than the conventional design and enhances responsivity very well. A surface morphology measurement of thermopile is implemented to evaluate the influence of residual stress and characterize geometric shape of membrane practically. More careful analysis of surface morphology show the bending of suspension parts has a deviation of responsivity less than 0.167%. For our work, the T-shape structure of thermopile with large absorption area and high performance by using CMOS compatible process is proven to be very successful and easy fabricated.

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Surface Morphology Measurement and Investigation of A New CMOS Compatible Thermopile with High Fill Factor

2006 IEEE Instrumentation and Measurement Technology Conference Proceedings

2006

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A New Structure for CMOS Thermal-Bubble-Based Accelerometer

2007 IEEE Instrumentation &Amp; Measurement Technology Conference IMTC 2007

Yang

2007

In this paper, we design andfabrication a novel thermalbubble-based micromachined accelerometer with advantages of minimum solid thermal conductance and high sensitivity successfully. It can detect two-dimension acceleration changed and apply to technology of inclinometers, anemometers andflow meters. A new accelerometer consists of a micro heater and two pairs of thermopiles floating over an etched cavity that is constructed by our proposed micro-link structure. The heater and the thermopiles are connected by network-like structure of micro-links, which enhance the structure and greatly reduce the solid heatflow from the heater to the hot junctions of thermopiles. The samples are fabricated by TSMC 0. 35fum 2P4M CMOS process which is provided by CIC with outstanding strong structures and uniform quality. Our design is proved to be adequate for commercial batch production. We measure the output signal by inclining the sensor to evaluate the performance of this accelerometer. The measurement shows the output signal is inverse proportional to the tilt angel and the output voltage is increased when the input power increases. Furthermore, the sensitivity was obtainedfor acceleration vs. output voltage with an average slope of0. 325uVlg in this case.

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Design and Analysis of a Fast Infrared Tracking System with Winner-Take-All Implementation

Zhong

2008 IEEE Instrumentation and Measurement Technology Conference

2008