CMOS microsystems temperature control

Falconi, Christian; Fratini, Marco

doi:10.1016/j.snb.2007.07.071

Cited by 17 publications

(10 citation statements)

References 9 publications

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“…When the temperature conditions are poor, a high temperature coefficient [13], low linearity [14,15], and temperature drift [16] are extremely common. Therefore, research on high-precision, low-temperature sensitivity MEMS accelerometers has received great attention [17,18,19,20,21,22,23,24]. The temperature drift of bias (TDB) and temperature drift of scale factor (TDSF) are the two main indicators that characterize the effects of thermal phenomena on accelerometers.…”

Section: Introductionmentioning

confidence: 99%

Thermal Drift Investigation of an SOI-Based MEMS Capacitive Sensor with an Asymmetric Structure

Zhai

Tao

et al. 2019

Sensors

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High-precision, low-temperature-sensitive microelectromechanical system (MEMS) capacitive accelerometers are widely used in aerospace, automotive, and navigation systems. An analytical study of the temperature drift of bias (TDB) and temperature drift of scale factor (TDSF) for an asymmetric comb capacitive accelerometer is presented in this paper. A five-layer model is established for the equivalent expansion ratio in the TDB and TDSF formulas, and the results calculated by the weighted average of thickness and elasticity modulus method are closest to the results of the numerical simulation. The analytical formulas of TDB and TDSF for an asymmetric structure are obtained. For an asymmetric structure, TDB is only related to thermal deformation and fabrication error. Additionally, half of the fixed electrode distance is not included in the expressions of Δ d and Δ D for asymmetric structures, thus resulting in the TDSF of the asymmetric structure being smaller compared to a symmetric structure with the same structural parameters. The TDSF of the symmetric structure is [−200.2 ppm/°C, −261.6 ppm/°C], while the results of the asymmetric structure are [−11.004 ppm/°C, −72.404 ppm/°C] under the same set of parameters. The parameters of the optimal asymmetric structure are obtained for fabrication guidance using numerical methods. In the experiment, the TDSF and TDB of the packaged structure and the non-packaged structure are compared, and a significant effect of the package on the signal output is found. The TDB is reduced from 3000 to 60 μg/°C, while the TDSF is reduced from 3000 to 140 ppm/°C.

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Section: Introductionmentioning

confidence: 99%

Thermal Drift Investigation of an SOI-Based MEMS Capacitive Sensor with an Asymmetric Structure

Zhai

Tao

et al. 2019

Sensors

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“…Fourth, techniques for using solid-phase materials for separations in microflow have been identified 65–68. Finally, on-chip temperature control is available for temperature-dependent reactions such as PCR or simply for maintaining stability of the system in harsh environments 69–72. Conversion of these procedures to automated, on-chip manipulations can be a major step forward in eliminating the requirement for a technically trained operator, but microfluidic systems must first be developed that deal with real-world samples 73…”

Section: Automation and Microfluidics: Moving Optical Biosensors Out mentioning

confidence: 99%

Perspective on Optical Biosensors and Integrated Sensor Systems

2008

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Optical biosensors have begun to move from the laboratory to the point of use. This trend will be accelerated by new concepts for molecular recognition, integration of microfluidics and optics, simplified fabrication technologies, improved approaches to biosensor system integration, and dramatically increased awareness of the applicability of sensor technology to improve public health and environmental monitoring. Examples of innovations are identified that will lead to smaller, faster, cheaper optical biosensor systems with capacity to provide effective and actionable information. Keywords optical biosensors; microfluidics; optofluidics; polymer optics; nanotechnology; point of useIn the 1980's, only a limited number of groups were publishing data on optical sensors with integrated biological recognition molecules. 1-5 The possibility of moving a biosensor off an optical bench was still a long-term goal primarily because of the bulky optics available at the time. Moreover, reagent manipulations were all performed manually. The primary challenges being addressed were maintaining the activity of the recognition molecules after immobilization or entrapment, collecting the relatively weak fluorescent or absorbance signals, and discriminating a recognition event from nonspecific adsorption. Only after these problems were well understood and the manner in which they needed to be addressed was better appreciated could the next level of challenges be undertaken: consideration of binding kinetics at surfaces; operation under flow as opposed to static equilibrium conditions; utilization of new solid-state optical devices, recognition molecules, enzymes for signal amplification, and near-IR and long-lifetime fluorophores; multiplexed analyses; system automation; and constraints for utility at the point-of-use. Both as a result of this foundational work and advances in other fields, a number of new devices and techniques evolved including a wide variety of solid state optical elements, immobilization chemistries, genetically engineered recognition molecules, microarrays of capture molecules, and fluidics for continuous monitoring. The result has been a variety of relatively expensive but commercially available optical biosensors for specific application areas including medical diagnostics, environmental testing, and food safety. 6Twenty years from now, will we have the Star Trek Tricorder that tells us at a distance the identity of a target of interest, be it chemical, biological or mineral? Current users of optical biosensors clearly want a device usable anywhere by anyone that tests for everything of interest, in real-time, and at trivial expense. While it is unlikely that this goal will be accomplished, optical biosensors will be constructed to meet the needs of operators in various fields of use in cost-effective packages. For example, in ten years, biosensors with capacity to test for all common food pathogens in vegetable or carcass washes, beverages, or homogenized food samples could be in place. Point-of-ca...

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“…Some studies to solve these problems have been reported. The typical methods are temperature compensation with readout circuits [ 13 ] or using a thermostatic package [ 14 ]. Some other methods based on structure design and package stress isolation have also been proposed, such as a four point supporting frame [ 15 ], a highly symmetrical spring-mass structure [ 16 ], soft adhesive attachment [ 17 ], and special fabrication processes [ 18 ], but the methods are complicated and expensive [ 15 , 16 , 17 , 18 ].…”

Section: Introductionmentioning

confidence: 99%

A 4 mm2 Double Differential Torsional MEMS Accelerometer Based on a Double-Beam Configuration

Miao

Xiao

et al. 2017

Sensors

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This paper reports the design and simulation of a 4 mm2 double differential torsional MEMS accelerometer based on a double-beam configuration. Based on the structure of conventional torsional accelerometers, normally composed of one pair of proof masses and one torsional beam, this work explores the double differential configuration: a torsional accelerometer with two pairs of unbalanced proof masses rotating in reverse. Also, the torsional beam is designed as a double-beam structure, which is a symmetrical structure formed by two torsional beams separated by a certain distance. The device area of the novel accelerometer is more than 50 times smaller than that of a traditional double differential torsional MEMS accelerometer. The FEM simulation results demonstrate that the smaller device does not sacrifice other specifications, such as mechanical sensitivity, nonlinearity and temperature robustness. The mechanical sensitivity and nonlinearity of a ±15 g measuring range is 59.4 fF/g and 0.88%, respectively. Compared with traditional single-beam silicon structures, the novel structure can achieve lower maximum principle stress in critical regions and reduce the possibility of failure when high-g acceleration loading is applied along all three axes. The mechanical noise equivalent acceleration is about 0.13 mg/Hz in the theoretical calculations and the offset temperature coefficient is 0.25 mg/℃ in the full temperature range of −40 ℃ to 60 ℃.

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CMOS microsystems temperature control

Cited by 17 publications

References 9 publications

Thermal Drift Investigation of an SOI-Based MEMS Capacitive Sensor with an Asymmetric Structure

Thermal Drift Investigation of an SOI-Based MEMS Capacitive Sensor with an Asymmetric Structure

Perspective on Optical Biosensors and Integrated Sensor Systems

A 4 mm2 Double Differential Torsional MEMS Accelerometer Based on a Double-Beam Configuration

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