CO₂Laser Processing On Ceramic Substrates Of Light Emitting Diode Assisted By Compressed Gas

Abstract

2 The use of ceramic substrates in high power LEDs is becoming increasingly common. However, the brittleness of ceramics makes them difficult to process and susceptible to cracking. This study used a CO 2 laser with auxiliary gas to drill and cut Al 2 O 3 and AlN ceramic substrates. The authors investigated the influences of parameters such as auxiliary gas pressure, laser power, repetition rate, and working speed on processing quality, in terms of pattern size, surface roughness, hole taper angle, and fracturing. The experiment results show that Al 2 O 3 low-cost processing can be achieved with low laser power and high auxiliary gas pressure. In contrast, AlN has a high melting point and high thermal conductivity, for which lower auxiliary gas pressure is required to ensure high-quality processing.

Laser-Based Manufacturing of Ceramics: A Review

“…It was stated that the rate of material removal could reach 90%. Lee and Cheng [ 59 ] performed laser circular cutting for drilling operations over alumina and observed that the taper of drilling holes was greater than the attained circular cutting, however, this process consumed less time. It was also found that utilization of auxiliary gas pressure ranging from 20 psi to 50 psi yielded better results.…”