TXV Technology: The cornerstone of 3D system-in-packaging

Zhao, Heran; Chen, Mingxiang; Yang, Ping; Wang, Qing; Kang, Min; Cao, Lei

doi:10.1007/s11431-022-2119-3

Cited by 15 publications

(1 citation statement)

References 105 publications

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“…The basic components of a SiP’s design schematic are a combined chip, a silicon intermediary layer [ 18 ], a substrate, and a PCB, as depicted in Figure 3 . The chips are integrated in a 2.5D or 3D shape as a stack.…”

Section: Advanced Packaging Technologies In Sipmentioning

confidence: 99%

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Wang

Yang

et al. 2023

Micromachines

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The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

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Section: Advanced Packaging Technologies In Sipmentioning

confidence: 99%