“…Copper is the most widely used matrix material for heat sink applications due to its high thermal conductivity (400 Wm −1 K −1 ), high melting temperature, and good weldability [ 36 , 37 , 38 , 39 , 40 , 41 , 42 , 43 , 44 , 45 ]. To overcome the high coefficient of thermal expansion of copper, different reinforcements have been incorporated in the copper matrix, namely diamond particles [ 36 , 38 , 39 , 40 , 41 , 44 , 45 , 46 , 47 , 48 , 49 , 50 , 51 , 52 , 53 , 54 , 55 , 56 , 57 , 58 , 59 , 60 , 61 , 62 , 63 , 64 , 65 , 66 , 67 ], graphite (particles, fibers, or foam) [ 44 , 68 , 69 , 70 ], carbon fibers (CFs) [ 39 , 54 , 71 , 72 , 73 ], carbon nanotubes (CNTs) […”