Cold sintering approach to fabrication of high rate performance binderless LiFePO4 cathode with high volumetric capacity

Recent Progress in Applications of the Cold Sintering Process for Ceramic–Polymer Composites

“…With cold sintering, we have the potential to form both high density cathodes and anodes, with the possibility for higher interfacial contact area. LiFePO 4 (LFP) cathode can be sintered to 80–90% of theoretical density by cold sintering process at 240 °C with the assistance of LiOH . It is also feasible to cold cosinter LFP with polymer and carbon, as shown in Figure d,e.…”

“…Compared with the reported data in the literature, the volumetric capacity of cold sintered composite is improved, which results from the high densities and enhanced grain‐to‐grain contact. With carbon nanofibers (CNF), the volumetric capacity of cold sintered cathode composite LFP‐CNF can reach 247 mAh cm −3 at high charging rates 10 C …”

Cold Sintering of a Covalently Bonded MoS2/Graphite Composite as a High Capacity Li–Ion Electrode

“…which resulted in a successful consolidation of LAGP electrolytes at substantially reduced temperature, either with and without a polymeric phase of PVDF (Polyvinyldiflouride) ,. The exemplary studies followed by another remarkable consolidation process of CSP with a LiFePO 4 cathode which achieved 170mAh/g specific capacity with ∼89% relative density, as reported at Seo et al ,. The CSP technique accomplished densification in more than 60 inorganic compounds.…”

“…Recently, a “Cold sintering process (CSP)” was developed as a promising technique to fabricate ceramics at low temperatures and one attractive application area is the fabrication of high volumetric density battery cathodes and solid state electrolytes . The CSP method involves a transient liquid phase sintering approach that enables to densify ceramics up to 80%–99% relative densities, at extremely low sintering temperatures <300 °C with low to intermediate uniaxial pressures (50–500 MPa) .…”

“…In addition, it can provide sustainable manufacturing solutions with comparatively low sintering temperatures as well as the ability to enable multilayer devices when employing forming techniques such as tape casting and screen printing methods ,. As a result, CSP unlocks routes for a wide variety of materials and extends the scope of the application areas from microwave dielectrics, thermoelectrics, ferroelectrics, semiconductors, refractories, ionic conductors to battery electrodes, and electrolytes …”