Designing new approaches to incorporate dopant impurities in semiconductor materials is essential in keeping pace with electronics miniaturization without device performance degradation. On the basis of a mild solution-phase synthetic approach to functionalize silica nanoparticles, we were able to graft tailor-made boronmolecular precursors and control the thermal release of boron in the silica framework. The molecular-level description of the surface structure lays the foundation for a structure−property relationship approach, which is readily and successfully implemented to dope non-deglazed silicon wafers. As the method does not require an additional oxide capping step and shows minimal risk of carbon contamination, as demonstrated by compositional and electrical characterizations of the wafers, it is perfectly adapted to advanced microelectronics manufacturing processes.
■ INTRODUCTIONDopants play a critical role in semiconductor devices and are therefore a major focus of research. 1−3 For instance, several doping strategies have emerged and led to significant improvements to drive impurities (dopant) inside pure substrates and to reduce the variability of targeted electronic devices, together with increased performances for nanoobjects. 4−11 However, improving dopant incorporation, avoiding randomness of concentration, and investigating diffusion phenomena still represent an outstanding challenge today, in particular with the development of smaller nanosized devices. 8 Indeed, increasing the performance in microelectronics has been directly related to the continuing shrinking of transistors 12 and thus to their optimized properties. The control of dopant concentration and distribution in semiconductors is essential, 8 and several methods such as single-ion implantation, 6 chemisorption of dopant from gaseous hydride molecules, 9,10 spin-on doping, 11 or single-atom doping 13 have been investigated. The monolayer doping (MLD) concept 14 appeared to be well-adapted to the medium doping range targeted for transistors or junctions in Fins as well as in nanowire structures. 15,16 However, transferring this process to the microelectronic industry is difficult because it requires a rather nonmanufacturing-friendly substrate (hydrofluoric acid deglazed silicon) and the use of a low-temperature, conformal SiO 2 evaporation capping to avoid dopant evaporation upon annealing. To circumvent this capping issue, the monolayer contact doping (MLCD) concept was recently proposed. 17,18 While providing good results in the formation of (ultra)shallow junctions, the use of two substrates (donor and acceptor) makes this ex situ technique not as straightforward as approaches related to MLD, relying on only one substrate.In this work, we show how to avoid these issues by the use of a simple bottom-up methodology based on the grafting of tailored boron-containing molecular precursors (anchoring/ self-protected) on the thin layer of native silica present on top of silicon wafers. This method takes advantage of (i) the presence of a...