2020
DOI: 10.1080/09537287.2020.1769217
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Combining an automatic material handling system with lean production to improve outgoing quality assurance in a semiconductor foundry

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Cited by 13 publications
(3 citation statements)
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“…Three barriers to integration were identified as the most recurrent in the literature: high implementation costs [32,44,45,82], technological incompatibility [36,[83][84][85], and extended learning curves [75,[86][87][88]. Other relevant barriers were identified and are listed in Table 5.…”
Section: Integration Barriersmentioning
confidence: 99%
See 1 more Smart Citation
“…Three barriers to integration were identified as the most recurrent in the literature: high implementation costs [32,44,45,82], technological incompatibility [36,[83][84][85], and extended learning curves [75,[86][87][88]. Other relevant barriers were identified and are listed in Table 5.…”
Section: Integration Barriersmentioning
confidence: 99%
“…Technological feasibility-Barriers in this category include technical aspects affecting IT systems' horizontal and vertical integration in the context of I4.0 and their cooperation with LSS tools and techniques [81,83]. In this regard, insufficient or poorly designed IT infrastructure can be seen as the primary obstacle to this purpose [26,32,45,86].…”
Section: Integration Barriersmentioning
confidence: 99%
“…Semiconductor firms are capital intensive. It means that capacity utilization significantly affects the capital effectiveness and profitability of semiconductor firms [55][56][57]. The capital intensiveness is reasoned by the tremendous investment on complex processes of research and development (R&D) with rising costs required, the necessity of economy of scale, and the costs to upgrading plants or building new ones [58].…”
Section: A Characteristics Of the Semiconductor Industrymentioning
confidence: 99%