2014
DOI: 10.1364/oe.22.006108
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Compact 100Gb/s DP-QPSK integrated receiver module employing three-dimensional assembly technology

Abstract: We demonstrate a compact 100 Gbit/s DP-QPSK receiver module that is only 18 mm (W) x 16 mm (D) x 2.8 mm (H). The module size is reduced by using a ball grid array (BGA) package with three-dimensional assembly technology and by applying a heterogeneous integrated PLC. Error-free DP-QPSK signal demodulation is successfully demonstrated.

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Cited by 7 publications
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“…The density of the I/F ports of the BOX type was improved by using FPC according to the required speed and integration. For the next generation, a BGA type in which the I/F ports are arranged two-dimensionally on the package bottom is reported [51]. The TOSA/ROSA package follows the same progression as the electronic device packages, which indicates that increasing the density of the electrical I/F ports is a common issue for both the optical and electronic devices.…”
Section: Tosa/rosa For Beyond 400gbementioning
confidence: 98%
“…The density of the I/F ports of the BOX type was improved by using FPC according to the required speed and integration. For the next generation, a BGA type in which the I/F ports are arranged two-dimensionally on the package bottom is reported [51]. The TOSA/ROSA package follows the same progression as the electronic device packages, which indicates that increasing the density of the electrical I/F ports is a common issue for both the optical and electronic devices.…”
Section: Tosa/rosa For Beyond 400gbementioning
confidence: 98%