Compact and Physics-Based Modeling of 3-D Inductor Based on Through Silicon Via

Xiong, Wei; Dong, Gang; Zhu, Zhangming; Yang, Yintang

doi:10.1109/led.2021.3107320

Cited by 11 publications

(10 citation statements)

References 19 publications

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“…For the common on-chip inductor applications, the two common soft magnetic materials are CoZrTa and NiFe. As reported in [15,16], CoZrTa is found to have a relatively high saturation magnetization of 1.52T with low initial coercivity of 0.015Oe causing minimal hysteretic losses. The resistivity of CoZrTa is also higher, which can reduce the eddy currents and hence losses.…”

Section: Magneticssupporting

confidence: 65%

“…This technique not only increases the quality factor of inductor but is also compatible with the current sub-22nm process. Instead of a single layer of magnetic core, several thin laminations (0.5um) separated by silicon dioxide (~0.1 um) were used to suppress eddy currents [16][17][18][19][20][21][22]. Proper number of laminations and spacing between lamination layers is critical for TSV-inductor performance.…”

Section: Lamination Structure Of Magnetic Corementioning

confidence: 99%

“…Other applications such as resonant clocking [12] and RF circuits [13] are implemented using TSV inductors, with the physics-based modeling approach detailed in [12]. To improve its inductance and quality factor, a magnetic core can be inserted into the structure to achieve high quality factor and L/Rdc [6,7,[16][17][18][19][20][21][22]. As demonstrated in Fig.…”

Section: Introductionmentioning

confidence: 99%

“…The fabricated structure has achieved an inductance density of 111nH/mm2, 2× compared with a TSV-inductor without a magnetic core and 16× compared with a conventional planar inductor. Based on that, several works have extended the proposed 3D magnetic core inductors to various applications from high efficiency DC-DC converter, radio-frequency circuit, to biomedical implants [16,[19][20][21][22]. For example, a three-dimensional insilicon TSV magnetic-core toroidal inductor was designed for power supply in package, which has 3× inductance and 30% higher quality factor compared with similar TSV air-core inductors [16].…”

Section: Introductionmentioning

confidence: 99%

“…Based on that, several works have extended the proposed 3D magnetic core inductors to various applications from high efficiency DC-DC converter, radio-frequency circuit, to biomedical implants [16,[19][20][21][22]. For example, a three-dimensional insilicon TSV magnetic-core toroidal inductor was designed for power supply in package, which has 3× inductance and 30% higher quality factor compared with similar TSV air-core inductors [16]. Reference [20] reused a similar architecture in [6,7,18] to design and optimize a compact low pass filter.…”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter

Wen

Xiao

Chen

et al. 2022

ACM Trans. Des. Autom. Electron. Syst.

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The conventional on-chip spiral inductor consumes a significant top-metal routing area, thereby preventing its popularity in many on-chip applications. Recently through-silicon-via (TSV) based inductor (also known as TSV-inductor) with a magnetic core has been proved to be a viable option for the on-chip DC-DC converter. The operating conditions of these inductors play a major role in maximizing the performance and efficiency of the DC-DC converter. However, there is a critical need to study the design and optimization details of magnetic core TSV-inductors with the unique 3D structure embedding magnetic core. This paper aims to provide a clear understanding of the modeling details of a magnetic core TSV-inductor and a design and optimization methodology to assist efficient inductor design. Moreover, a machine learning assisted model combining physical details and artificial neural network (ANN) is also proposed to extract the equivalent circuit to further facilitate DC-DC converter design. Experimental results show that the optimized TSV-inductor with the magnetic core and air-gap can achieve inductance density improvement of up to 7.7 × and quality factor improvements of up to 1.6 × for the same footprint compared with the TSV-inductor without a magnetic core. For on-chip DC-DC converter applications, the converter efficiency can be improved by up to 15.9% and 6.8% compared with the conventional spiral and TSV-inductor without magnetic core, respectively.

show abstract

Section: Magneticssupporting

confidence: 65%

Section: Lamination Structure Of Magnetic Corementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter

Wen

Xiao

Chen

et al. 2022

ACM Trans. Des. Autom. Electron. Syst.

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A two-step optimization strategy for the inductance control of TSV-based 3-D inductor based on the SAE model

Wang,

Yang,

Chen

et al. 2024

Struct Multidisc Optim

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Modeling and Thermal Stress Coupling Optimization Design of TSV Inductors in On-Chip DC/DC Converters

Wang,

Xiong,

Geng

2023

IEEE Access

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As advances in fabrication technology continue and the power density of microelectronic devices increases, efficient and highly integrated through-silicon via (TSV) inductors have emerged as a viable solution for addressing challenges in power and thermal stress management in on-chip direct currentto-direct current (DC/DC) converters. This study proposes a method for modeling and optimizing TSV inductors with magnetic cores based on thermal stress and lumped circuit. CoZrTa is selected as the magnetic core material, and RLCG circuit modeling is performed for multiple factors, including resistance, inductance value, and parasitic capacitance. To validate the accuracy of the model, simulation tests were conducted using ANSYS HFSS and SPICE tools. The results show that under low-frequency conditions (< 2GHz), the error between the model and the 3D full-wave simulation for L and Q parameters is less than 3.3%, proving the model's accuracy. Furthermore, a deep reinforcement learning optimization design model based on the deep deterministic policy gradients (DDPG) algorithm is proposed, which comprehensively considers factors such as current ripple, power loss, parasitic parameters, and thermal stress. With almost no change in electrical performance, the thermal stress in the optimized TSV inductor array decreased by 11.91% and its distribution was improved, reducing the likelihood of fatigue damage.

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Compact and Physics-Based Modeling of 3-D Inductor Based on Through Silicon Via

Cited by 11 publications

References 19 publications

Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter

Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter

A two-step optimization strategy for the inductance control of TSV-based 3-D inductor based on the SAE model

Modeling and Thermal Stress Coupling Optimization Design of TSV Inductors in On-Chip DC/DC Converters

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