Compact, lightweight, and highly efficient circular heat sink design for high-end PCs

Choi, Joon Hyouk; Jeong, Minjoong

doi:10.1016/j.applthermaleng.2015.09.096

Cited by 24 publications

(7 citation statements)

References 14 publications

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“…Built-up monolayers on the wire surface inuence the nucleation site density and departure diameter that helps a bubble to develop and grow. 12 The deposition of nanoparticles as a nano or microlayer on the heating wire surface can enhance signicantly the critical heat ux values by changing the surface morphologies. CHF enhancement can be explained by increasing the wettability and roughness of the wire surface.…”

Section: Extended Critical Heat Ux (Echf)mentioning

confidence: 99%

“…11 The CHF phenomenon is complex, difficult to understand, irreversible, and unpredictable; thus, many studies have tried to analyze CHF conditions for thermal systems in order to avoid encountering dangerous situations such as increases in the wall temperature by vapor cover and the breaking of wires etc. 12 Researchers have tried many times to increase CHF for effective and safer heat transfer using improved heater-surface wettability and morphology such as in micro/nano-structured heater surfaces. 13 The enhancement of CHF is related to the build-up of a deposition layer of nanoparticles during the boiling of Nfs.…”

Section: Introductionmentioning

confidence: 99%

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In situ generated hydrophobic micro ripples via π–π stacked pop-up reduced graphene oxide nanoflakes for extended critical heat flux and thermal conductivities

Cheedarala

Song

2019

RSC Adv.

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Section: Extended Critical Heat Ux (Echf)mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

In situ generated hydrophobic micro ripples via π–π stacked pop-up reduced graphene oxide nanoflakes for extended critical heat flux and thermal conductivities

Cheedarala

Song

2019

RSC Adv.

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“…In another study, performed by Choi et al [16], numerical simulations were used to improve the design of a CPU cooler with lower overall thermal resistance. A similar numerical simulation, proposing a novel lightweight heat sink with lower production costs and noise levels, was conducted by Choi et al [28].…”

Section: Introductionmentioning

confidence: 92%

Experimental and numerical heat transfer analysis of heat-pipe-based CPU coolers and performance optimization methodology

Može

Nemanič

Poredoš

2020

Applied Thermal Engineering

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This paper presents an experimental and numerical heat transfer analysis of heat-pipe-based CPU coolers and a performance optimization methodology. The first part of the study focuses on the performance of two commercial HP-based CPU coolers under inclination angles of 0°, 90° and 180°. The results show that the 90° orientation provides the best thermal performance. The influence of heat pipe orientation on the performance of the entire system is obscured due to the much higher thermal resistance on the air-side of the cooler. A fourfold increase in air volumetric flow rate has only a minor effect on the cooling performance enhancement with a reduction of the thermal resistance from 0.11 K W-1 to 0.074 K W-1 at the highest heating power. In the second part of the study, heat transfer numerical simulations of the finned part of a cooler were performed and validated using experimental results. The output of the simulation is a 2-D temperature field, which is used as an input for the optimization methodology based on fin effectiveness and fin efficiency. Optimizing the fin geometry by removing unnecessary material yielded a 23% increase of the fin efficiency and decreased the weight of a fin by approx. 30%, proving the usefulness of the proposed methodology, which helps reduce costs, weight and development time of finned HP-based coolers.

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“…The Joule heating in electronic devices is a significant hindrance to their safe functionality and efficient performance. It is vital for most of the electronic components, such as integrated circuits, microprocessors and control systems, to maintain the low operating temperatures (below ~85 °C) to ensure durability, stable operation and prevention of thermal hazards [ 3 , 4 ].…”

Section: Introductionmentioning

confidence: 99%

A Parametric Study of the Effects of Critical Design Parameters on the Performance of Nanoscale Silicon Devices

2020

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The current electronics industry has used the aggressive miniaturization of solid-state devices to meet future technological demands. The downscaling of characteristic device dimensions into the sub-10 nm regime causes them to fall below the electron–phonon scattering length, thereby resulting in a transition from quasi-ballistic to ballistic carrier transport. In this study, a well-established Monte Carlo model is employed to systematically investigate the effects of various parameters such as applied voltage, channel length, electrode lengths, electrode doping and initial temperature on the performance of nanoscale silicon devices. Interestingly, from the obtained results, the short channel devices are found to exhibit smaller heat generation, with a 2 nm channel device having roughly two-thirds the heat generation rate observed in an 8 nm channel device, which is attributed to reduced carrier scattering in the ballistic transport regime. Furthermore, the drain contacts of the devices are identified as critical design areas to ensure safe and efficient performance. The heat generation rate is observed to increase linearly with an increase in the applied electric field strength but does not change significantly with an increase in the initial temperature, despite a marked reduction in the electric current flowing through the device.

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Compact, lightweight, and highly efficient circular heat sink design for high-end PCs

Cited by 24 publications

References 14 publications

In situ generated hydrophobic micro ripples via π–π stacked pop-up reduced graphene oxide nanoflakes for extended critical heat flux and thermal conductivities

In situ generated hydrophobic micro ripples via π–π stacked pop-up reduced graphene oxide nanoflakes for extended critical heat flux and thermal conductivities

Experimental and numerical heat transfer analysis of heat-pipe-based CPU coolers and performance optimization methodology

A Parametric Study of the Effects of Critical Design Parameters on the Performance of Nanoscale Silicon Devices

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