Abstract:This paper presents the design and performance of two new quad flat non-leaded (QFN) packaged high power amplifiers operating at Ka-Band. The packaged amplifiers are fully compatible with conventional SMD assembly processes which significantly reduce assembly cost and complexity. The QFNs themselves are standard off-the-shelf low-cost plastic aircavity packages. Matching networks that were designed to compensate packaging and wire-bond related parasitics will be presented. The 1-Watt 4x4mm 2 QFN packaged ampli… Show more
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