Comparative evaluations on scallop-induced electric-thermo-mechanical reliability of through-silicon-vias

Zhi-qiang, Cheng; Ding, Yingtao; Xiao, Lei; Wang, Xinghua; Chen, Zhiming

doi:10.1016/j.microrel.2019.113512

Cited by 17 publications

(3 citation statements)

References 21 publications

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“…With the development of the integrated circuit industry, polyimide (PI) has been extensively applied in the microelectronics field for its outstanding properties. [1][2][3][4] Traditional polyimide needs to be heat cured above 350 1C to ensure excellent performances, which limits its application in some processes of semiconductor manufacturing. [5][6][7] For example, the fan-out wafer level package (FOWLP) has attracted widespread attention from researchers and industries due to its low-cost and high I/O courts.…”

Section: Introductionmentioning

confidence: 99%

Constructing high-performance low-temperature curable PI materials by manipulating the side group effects of diamine

Huang

Zhang

et al. 2023

J. Mater. Chem. C

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Section: Introductionmentioning

confidence: 99%

Constructing high-performance low-temperature curable PI materials by manipulating the side group effects of diamine

Huang

Zhang

et al. 2023

J. Mater. Chem. C

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“…Aromatic polyimides (PI) are an important class of electronic packaging materials owing to their excellent insulation properties, acceptable dielectric properties, outstanding mechanical and thermal properties, and exceptional chemical resistance, which mainly applied to interlayer dielectric, passivation layers, DOI: 10.1002/marc.202300374 electrical insulators, alpha-particle shielding materials, conductive adhesives, et al [1][2][3][4] However, with the development of advanced packaging and increasing wafer size, traditional PI often leads to wafer warpage due to high curing temperature (> 350 °C). [5][6][7] Therefore, the preparation of low-temperature curable polyimide with good properties has gained generous attention.…”

Section: Introductionmentioning

confidence: 99%

Exploring the Impact of Blend and Graft of Quinoline Derivative in Low‐Temperature Curable Polyimides

Huang,

Lv,

Zhang

et al. 2023

Macromol. Rapid Commun.

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The utilization of accelerators has been a common approach to prepare low‐temperature curable polyimide (PI). However, the accelerators have gradually fallen out of favor because of their excessive dosages and negative effect on the properties of PI. In this work, a new strategy of introducing accelerators by grafting to eliminate these disadvantages is presented. A novel quinoline derivative named NQL was designed for this purpose, and an ultra‐low dosage of only 2.5 mol% was sufficient to prepare low‐temperature curable PI. The favorable low‐temperature curing effect of NQL was attributed to its strong alkalinity (pKa = 18.47) and electron‐donating ability (HOMO = ‐6.22 eV). At a curing temperature of 200 °C, the PI with 2.5 mol% NQL showed outstanding properties (Young's modulus of 5.73 GPa, elongation of 37.3%, tensile strength of 237 MPa and coefficient of thermal expansion of 16 ppm/K). In particular, NQL could even lower the curing temperature to 180 °C and the ultra‐low temperature curable PI film still retained excellent properties. These results demonstrate that introducing low‐temperature curable accelerators by partial grafting instead of blending is a promising way to furnish low‐temperature curable PI, and provide insights into the preparation of polyimide with high performance in advanced packaging.This article is protected by copyright. All rights reserved

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“…Many studies have used FEA to investigate the thermo-mechanical reliability of TSV structures. Xue et al (2018) and Cheng et al (2019) used FEA to investigate the effect of sidewall scallops on the stresses and reliability of TSV interposers. Banijamali et al (2011) used FEA to study the warpage and stress levels in TSV interposers and their interconnects.…”

Section: Introductionmentioning

confidence: 99%

The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study

Ahmed

Okoro

Pollard

et al. 2020

MMMS

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PurposeThis study aims to investigate the factors responsible for substrate cracking reliability problem in through-glass vias (TGVs), which are critical components for glass-based 2.5 D integration.Design/methodology/approachNumerical models were used to examine the driving force for substrate cracking in glass interposers due to stress coupling during heating. An analytical solution was used to demonstrate how the energy release rate (ERR) for the glass substrate cracking is affected by the via design and the mismatch in thermal strain. Then, the numerical models were implemented to investigate the design factors effects, such as the pitch distance, via diameter, via pattern, via design, effect from a stress buffer layer and the interposer materials selection on the susceptibility to substrate cracking.FindingsERR for substrate cracking was found to be directly proportional to the via diameter and the thermal mismatch strain. When a via pattern is implemented for high-density integration, a coupling in the stress fields was identified. This coupling effect was found to depend on the pitch distance, the position of the vias, and the via arrangement, suggesting a via pattern-dependent reliability behavior for glass interposers. Changing the design of the via to an annular shape or a substrate-cored via was found to be a promising approach to reduce the susceptibility to substrate cracking compared to a fully filled solid via. Also, the use of a stress buffer layer, an encouraging design prospect presented for the first time for TGVs in this study, was found to significantly reduce cracking. Finally, alternative via and substrate materials showed lower tendency for substrate cracking, indicating that the reliability of glass interposers can be further enhanced with the implementation of such new materials.Originality/valueThis study signifies the first attempt to comprehensively evaluate the susceptibility to crack formation in glass interposers during heating. Therefore, this study provides new perspectives on how to achieve a significant potential reliability improvement for TGVs.

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Comparative evaluations on scallop-induced electric-thermo-mechanical reliability of through-silicon-vias

Cited by 17 publications

References 21 publications

Constructing high-performance low-temperature curable PI materials by manipulating the side group effects of diamine

Constructing high-performance low-temperature curable PI materials by manipulating the side group effects of diamine

Exploring the Impact of Blend and Graft of Quinoline Derivative in Low‐Temperature Curable Polyimides

The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study

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