Constructing high-performance low-temperature curable PI materials by manipulating the side group effects of diamine

Abstract

To date, low-temperature curable polyimide (PI) materials are in great demand in the field of advanced packaging. However, their synthesis is still a challenge due to the distinct structural design...

Exploring the Impact of Blend and Graft of Quinoline Derivative in Low‐Temperature Curable Polyimides

“…It may be easier for quinoline derivatives to attack the reactive centers (the amidoacid fragments) when grafted at polyimide molecular chains, and thus lead to better catalytic effect of low‐temperature curing according previous research. [ 31 ] In particular, PI‐NQL‐2.5% showed the smallest d ‐spacing (4.36 Å) and the highest ID (90.0%) among the samples. This result indicated that the introduction of accelerator by grafting enhanced the intermolecular force of polyimide and reduced the curing temperature simultaneously.…”

Fluorinated Polyimide Tunneling Layer for Efficient and Stable Perovskite Photovoltaics

“…The structure of dianhydride and diamine monomers can be flexibly controlled in PI synthesis, providing PIs with a greater variety of characteristic functional groups and tailored properties. [45,46] In this context, we designed and synthesized a new fluorinated polyimide (FPI) named 6FDA-6FAPB, which contains ether bonds (À OÀ ) and trifluoromethyl groups (À CF 3 ), and applied it for the first time to passivate defects on the top perovskite surface. Both the carbonyl group (C=O) and À OÀ possess the capability to coordinate with uncoordinated Pb 2 + in perovskite, facilitating the passivation of defects and improvement in device performance.…”

“…Polyimides (PIs), on the other hand, formed through the polycondensation of dianhydride and diamine monomers, [43,44] are scarcely studied in facilitating the operation of PSCs. The structure of dianhydride and diamine monomers can be flexibly controlled in PI synthesis, providing PIs with a greater variety of characteristic functional groups and tailored properties [45,46] …”

Synthesis of Novel Nonisocyanate Poly(imide-urea)s from CO2-based Polyureas

“…30 Consequently, high-performance PI materials with low imidization temperatures has become a concern in the fields such as electronics, advanced packaging, and semiconductor. 31,32 Moreover, the high glass transition temperature (T g ) and poor solubility limit their processing and molding capacities. 33−37 To address these limitations, hybridization methodology, combining different polymeric structures, has emerged as a common approach to synthesize novel polyimide composite polymers.…”

“…Polyimides, renowned for their exceptional mechanical performance, good thermal stability, and antisolvent properties, serve a wide application in aerospace, defense, optoelectronics, and gas separation membrane. − However, traditional polyimides are typically cured at 300–400 °C to ensure sufficient thermal and mechanical properties, such a high processing temperature has limited their application . Consequently, high-performance PI materials with low imidization temperatures has become a concern in the fields such as electronics, advanced packaging, and semiconductor. , Moreover, the high glass transition temperature ( T g ) and poor solubility limit their processing and molding capacities. − To address these limitations, hybridization methodology, combining different polymeric structures, has emerged as a common approach to synthesize novel polyimide composite polymers. The synthesized polyurea-polyimide composites exhibit improved properties with thermal stability and mechanical properties superior to those of PUa or polyimide. ,,− For the preparation of poly­(imide-urea)­s (PIUs), various routes were explored.…”