Comparative Reliability of Inkjet-Printed Electronics Packaging

Tilford, T.; Stoyanov, Stoyan; Braun, Jessica; Janhsen, Jan Christoph; Patel, Mayur; Bailey, C.

doi:10.1109/tcpmt.2021.3049952

Cited by 11 publications

(10 citation statements)

References 54 publications

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“…Indeed, all the examples shown in Section IV and the experimental results presented in this section are publicly available in a GitHub repository. 3 The repository contains the rendered images and the corresponding Gerber files. Additional documentation of the experimental methodology is provided in the repository.…”

Section: Resultsmentioning

confidence: 99%

“…are negative, it means that the same coordinate of origin must be subtracted the same negative value in millimeters (to correct the origin of the image with new size) as formulated in (3). Finally, the temporary image is added to the image (not to lose any data) considering the new origin translation transformation, and then, the graphic object is added to the image.…”

Section: Operatorstackpop()mentioning

confidence: 99%

“…According to the related Gerber information found in the literature as well as commercial online libraries and viewers, only a few fully support the Gerber X2 format specification, 3 https://github.com/sousarbarb/V7DParser/ being able to handle additional Gerber commands compared to the previous X1 format, such as macro apertures, aperture blocks, and load rotation. As a result, the GerbView [14] (Software Companions) application is selected as an alternative to compare with the achieved results in terms of renderization accuracy due to stating that it is capable of interpreting Gerber X2 files.…”

Section: A Tested Gerber Viewers and Librariesmentioning

confidence: 99%

“…the process more agile [1]- [3]. The objective of the VINCI7D project is the development of a robotic printing solution to be used for printing thin-film devices on 3D polymeric structures [4].…”

Section: Introductionmentioning

confidence: 99%

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Gerber File Parsing for Conversion to Bitmap Image–The VINCI7D Case Study

et al. 2022

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The technological market is increasingly evolving as evidenced by the innovative and streamlined manufacturing processes. Printed Circuit Boards (PCB) are widely employed in the electronics fabrication industry, resorting to the Gerber open standard format to transfer the manufacturing data. The Gerber format describes not only metadata related to the manufacturing process but also the PCB image. To be able to map the electronic circuit pattern to be printed, a parser to convert Gerber files into a bitmap image is required. The current literature as well as available Gerber viewers and libraries showed limitations mainly in the Gerber format support, focusing only on a subset of commands. In this work, the development of a recursive descent approach for parsing Gerber files is described, outlining its interpretation and the renderization of 2D bitmap images. All the defined commands in the specification based on Gerber X2 generation were successfully rendered, unlike the tested commercial parsers used in the experiments. Moreover, the obtained results were comparable to those parsers regarding the commands they can execute as well as the ground-truth, emphasizing the accuracy of the proposed approach. Its top-down and recursive architecture allows easy integration with other software regardless of the platform, highlighting its potential inclusion and integration in the production of electronic circuits.

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Section: Resultsmentioning

confidence: 99%

Section: Operatorstackpop()mentioning

confidence: 99%

Section: A Tested Gerber Viewers and Librariesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Gerber File Parsing for Conversion to Bitmap Image–The VINCI7D Case Study

et al. 2022

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“…Ink-jet printing, by which semiconductor materials can be deposited on flexible substrates such as polymer films or paper, is one such promising alternative. [5][6][7] However, due to the difficulty in formulating the printable ink precursors of inorganic materials compared to organic ones, printing technology is generally uncommon in metal oxides TFTs, particularly in p-type channels. [8,9] Another obstacle facing this technology is how to improve the purity and densification of the metal-oxide-metal (M-O-M) framework in the solution-processed thin films at low temperatures.…”

mentioning

confidence: 99%

Recent Progress of Solution‐Processed Copper‐based p‐Channel Thin‐Film Transistors

Al-Jawhari

2021

Adv Elect Materials

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unstoppable march of today's technology, it is of great demand to develop alternative and inexpensive processing technologies for fabricating high-performance p-channel TFTs. Ink-jet printing, by which semiconductor materials can be deposited on flexible substrates such as polymer films or paper, is one such promising alternative. [5][6][7] However, due to the difficulty in formulating the printable ink precursors of inorganic materials compared to organic ones, printing technology is generally uncommon in metal oxides TFTs, particularly in p-type channels. [8,9] Another obstacle facing this technology is how to improve the purity and densification of the metal-oxide-metal (M-O-M) framework in the solution-processed thin films at low temperatures. To resolve this problem and allow device flexibility, novel approaches based on manipulating the metal salt precursor, solvents, and postdeposition annealing methods had been established. [10,11] Stability, or reproducibility under ambient conditions of humidity and temperature, [12] is a third challenge facing solution-based oxide electronic devices. These roadblocks are common for all solution-based metal oxide thin films, yet p-type metal oxide TFTs in particular, face another essential defiance which is the lack of appropriate hole mobility. The most critical issues that solutionbased p-type metal oxide TFTs need to resolve are summarized schematically in Figure 1a.The difficulty in achieving p-type metal oxides with analogous performance to the n-type counterparts originates from the entirely different configurations of their conduction band minimum (CBM) and valence band maximum (VBM). Mainly, in metal oxides the CBM consists of metal s orbitals, offering a small electron effective mass and thus high mobility. In contrast, the VBM is principally composed of localized oxygen 2p orbitals, resulting in a large hole effective mass and accordingly low mobility. [13] Therefore, reducing the localization behavior of the VBM, via an engineered modification, is required to obtain suitable p-type oxide materials. [14] Up until now, only a few p-type oxide semiconductors (copper oxide, [15] tin monoxide, [16] and nickel oxide [17] ) were reported as active channel materials for TFTs. Their VBMs were inherently modified by the hybridization of metal (M) s states with oxygen (O) 2p states which result in delocalized VBMs and hence good holes mobility. [18] Copper oxide (Cu x O), with its native hybridization of Cu 3d and O 2p near the VBM, is one of the most promising holetransporting oxide semiconductors. [19] The copper oxide system (CuO) has two stable phases; cubic Cu 2 O (cuprous oxide) and The development of well-performing p-type semiconductors is essential in pushing transparent electronics to the next frontier. Copper oxide (Cu x O) is a potentially attractive hole-transport material for such applications because of its native p-type semi-conductivity, abundant availability, non-toxic nature, and low production cost. Solution-based processing methods offer many other...

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