Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2013
DOI: 10.1109/ipfa.2013.6599199
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Comparative study of different Copper wire decapsulation techniques for failure analysis

Em Julius N. De La Cruz1,
Andrew C. Sabate2,
Shiela Lyn A. Estrera3
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Failure mechanisms in encapsulated copper wire-bonded devices

Manoharan
1
,
KrishnanRamaswami
2
,
McCluskey
3
et al. 2016
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Failure mechanisms in encapsulated copper wire-bonded devices

Manoharan
1
,
KrishnanRamaswami
2
,
McCluskey
3
et al. 2016
2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
14
0
2
0
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Innovation in Copper Bond Wire Package Immersion Decapsulation Technique for Stressed SOIC Products

Beboso,
Yabut,
Balabbo
et al. 2023
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Development of Model for Identification of Process Parameters for Wet Decapsulation of Copper–Aluminum Wirebond in PEMs

Lall
1
,
Deshpande
2
,
Nguyen
3
2017
IEEE Trans. Compon., Packag. Manufact. Technol.
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