Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system

Wang, Fengjiang; Li, Dongyang; Wang, Jiheng; Wang, Xiaojing; Dong, Changhui

doi:10.1007/s10854-016-5705-9

Cited by 7 publications

(1 citation statement)

References 43 publications

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“…Adding a small amount of Zn to Sn-0.7Cu solder was studied by Wang et al and found that it can significantly reduce the formation of Cu 6 Sn 5 , and when the amount of doped Zn exceeded 0.8 wt%, the IMC would become Cu 5 Zn 8 [21]. Wang et al also found that the addition of 0.2 wt% Zn to pure Sn solder significantly suppressed the thickness growth of IMCs [22].…”

Section: Introductionmentioning

confidence: 99%

Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

2019

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Excessive growth of intermetallic compounds (IMCs) during service affects the reliability of solder joints, so how to suppress the growth of IMC thickness at the interface in solder joints becomes a widespread concern. In this work, the interfacial reaction between Sn-10Bi solder and Cu substrate after thermal aging was investigated. Moreover, to depress the IMC growth at the interface, trace amounts of Zn was added into the Sn-10Bi solder, and the interfacial reactions of Sn-10Bi-xZn solders (x = 0.2, 0.5) and Cu substrate after thermal aging were studied in this paper. Compounds such as Cu6(Sn, Zn)5 and Cu5Zn8 were formed at the interface after adding trace amounts of Zn. The addition of 0.2 and 0.5 wt% Zn significantly inhibited the thickness growth of IMCs and the formation of Cu3Sn IMC at the interface of Sn-10Bi-0.2Zn/Cu and Sn-10Bi-0.5Zn/Cu during thermal aging. Therefore, the addition of trace Zn had an obvious effect on the interfacial reaction of Sn-10Bi/Cu solder joint. Interestingly, the evolution of IMC thickness in Sn-10Bi-0.5Zn/Cu solder joints was completely different from that in Sn-10Bi or Sn-10Bi-0.2Zn solder joints, in which the spalling of IMCs occurred. In order to explore the mechanisms on the depressing effect from the addition of trace Zn, the activation energy Q in solder joints during aging was calculated.

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Section: Introductionmentioning

confidence: 99%