Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state

Du, Yahong; Gao, Li-Yin; Liu, Zhi-Quan

doi:10.1007/s10854-019-02840-6

Cited by 10 publications

(8 citation statements)

References 25 publications

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“…IMCs formation at the Au-Al interface caused Kirkendall voids, which resulted in interface resistance increase following non-constant Fickian law [ 43 ]. Du et al [ 44 ] investigated the electromigration (EM) reliability and failure analysis of Au wire bonding process on Al substrate. The results showed that the interaction between the applied electric field and lattice defects increased the diffusing atomic migration and accelerated the IMCs formation.…”

Section: Au Bonding Wirementioning

confidence: 99%

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Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

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Section: Au Bonding Wirementioning

confidence: 99%

“… The cross-section images of bonding interface of Au wire after aging at 130 °C for 200 h [ 44 ]. Copyright, 2020, Springer Nature.…”

Section: Figurementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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“…Extensive research has been conducted by scholars on the influence of IMCs on the reliability of Cu wire bonding. Yahong Du et al [ 52 ] systematically studied and compared the reliability and failure analysis of Cu wire and Au wire bonding processes on Al substrates after successful bonding. The results revealed that the Au wire bond interface exhibited thicker IMCs, as well as more voids and cracks, compared to the Cu wire bond interface, indicating a close correlation between the growth of IMCs and the presence of cracks.…”

Section: Bonding Reliabilitymentioning

confidence: 99%

Copper Wire Bonding: A Review

et al. 2023

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This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their characteristics and application areas are discussed. Additionally, we provide detailed insights into the impact of Free Air Ball (FAB) morphology on bonding reliability, including its effect on bond strength and formation mechanisms. Next, the reliability of Cu wire bonding is analyzed, with a focus on the impact of intermetallic compounds and corrosion on bonding reliability. Specifically, the formation, growth, and stability of intermetallic compounds at bonding interfaces are discussed, and their effects on bonding strength and reliability are evaluated. The detrimental mechanisms of corrosion on Cu wire bonding and corrosion inhibition methods are also analyzed. Subsequently, the applications of simulation in Cu wire bonding are presented, including finite element analysis and molecular dynamics simulations, which provide important tools for a deeper understanding of the bonding process and failure mechanisms. Finally, the current development status of Cu wire bonding is summarized, and future research directions are discussed.

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“…Black corrosion products are also attached to the surface of the steel sheet, and the specific phase composition needs to be further analyzed by XRD. When the concentration of corrosion inhibitor reached more than 0.5%, spot corrosion was observed, mainly because of the uneven adsorption of corrosion inhibitor, a small anode/large cathode activation -passivation battery system is formed [19,20]. Blank 0.1% 0.2% 0.5% 1.0% 2.0% Fig.…”

Section: Evaluation Of Corrosion Inhibition Of Triazinementioning

confidence: 99%

Characteristics Analysis and Corrosion Inhibition in Typical Produced Water of Jidong Oilfield

Chen

2021

E3S Web Conf.

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The composition of oilfield water is complex and diverse. The development and application of corrosion inhibitors can effectively inhibit the corrosion of pipelines and equipment by oilfield water. The ions in produced water of Jidong Oilfield were determined by instrumental analysis and chemical analysis. Triazine prepared from ethanolamine and formaldehyde as corrosion inhibitor was evaluated by weight loss method. The corrosion inhibition experiments were carried out in ancient water samples, and the effects of concentration and temperature on corrosion inhibition were investigated. Finally, corrosion inhibitors were applied to the corrosion inhibition of produced water with different compositions in Jidong Oilfield, the corrosion inhibition of steel sheet was evaluated under different salinity conditions, and the effects of various ion contents in typical water samples and salinity on corrosion inhibition were analyzed. The experimental results show that the corrosion inhibition effect of triazine is better, and the product can be used in various water samples in oilfield with the inhibition efficiency above 85%.

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Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state

Cited by 10 publications

References 25 publications

Research Progress on Bonding Wire for Microelectronic Packaging

Research Progress on Bonding Wire for Microelectronic Packaging

Copper Wire Bonding: A Review

Characteristics Analysis and Corrosion Inhibition in Typical Produced Water of Jidong Oilfield

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