Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size

Kim, Hyuk-Min; Park, Gun-Ho; Seo, Young-Gil; Moon, Deog-Ju; Cho, Byoung-Jun; Park, Jin-Goo

doi:10.1016/j.wear.2015.02.029

Cited by 43 publications

(16 citation statements)

References 29 publications

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“…The double-sided lapping behavior of sapphire substrates using fixed diamond abrasive pads is evaluated in [12,13]. The conclusion shows that the removal rate is highly sensitive to lap plate pressure and abrasive grain size.…”

Section: Principle Of Lapping and Related Workmentioning

confidence: 99%

Developing an Analytical Model and Computing Tool for Optimizing Lapping Operations of Flat Objects Made of Alloyed Steels

Deaconescu

2020

Materials

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Lapping is a finishing process where loose abrasive grains contained in a slurry are pressed against a workpiece to reduce its surface roughness. To perform a lapping operation, the user needs to set the values of the respective lapping conditions (e.g., pressure, depth of cut, the rotational speed of the pressing lap plate, and alike) based on some material properties of the workpiece, abrasive grains, and slurry, as well as on the desired surface roughness. Therefore, a mathematical model is needed that establishes the relationships among the abovementioned parameters. The mathematical model can be used to develop a lapping operation optimization system, as well. To this date, such a model and system are not available mainly because the relationships among lapping conditions, material properties of abrasive grains and slurry, and surface roughness are difficult to establish. This study solves this problem. It presents a mathematical model establishing the required relationships. It also presents a system developed based on the mathematical model. In addition, the efficacy of the system is also shown using a case study. This study thus helps systematize lapping operations in regard to real-world applications.

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Section: Principle Of Lapping and Related Workmentioning

confidence: 99%

Developing an Analytical Model and Computing Tool for Optimizing Lapping Operations of Flat Objects Made of Alloyed Steels

Deaconescu

2020

Materials

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“…Firstly, compared with current industry lapping removal rate of 3~4 µm/min, MRR of 10.0 µm/min is obtained in double-sided planetary grinding for the following reasons. 3-body and 2-body lapping system are defined to describe fixed abrasive lapping and free abrasive lapping, respectively, in previous literature [23]. According to literature [24], higher hardness platen obtained higher removal rate, and double-sided planetary grinding could be seen as 2-body lapping, in which high hardness platen is used.…”

Section: The Dent Depth Of Sapphire Surfacementioning

confidence: 99%

“…Kondratenko V. S. [18][19][20] researched the preparation of fixed abrasive grinding tools. Experimental research was carried out by John et al [21], Kin et al [22], and Kim et al [23,24]. TrizactTM Diamond Tile (TDT) lapping pad, which was produced by 3M, USA, was used as lapping tool in these experiments, and various factors affecting the Material removal rate (MRR) were experimentally studied.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Double-Sided Planetary Grinding Using Diamond Wheels for Sapphire Substrates

Wang

Huang

et al. 2018

Crystals

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Double-sided planetary grinding as an efficient and precise machining method is used for the rapid thinning and flattening process of sapphire substrate. As an intermediate processing technology of sapphire substrate preparation procedure, many experiments are carried out to evaluate the lapping effect in the paper. Surface quality, processing efficiency, and surface dent depth, which all impact subsequent polishing processes, are evaluated. Firstly, the four stages of grinding process are analyzed to display the surface accuracy changing process of the sapphire substrates during grinding. Secondly, the effect of three main grinding parameters (grinding pressure, rotation speed of the grinding wheels, and the grain size of grinding wheels) on surface accuracy and processing efficiency are investigated. Finally, sapphire removal rate of about 10 µm/min is achieved easily at the optimized condition with a good surface quality by double-sided planetary grinding. The double-sided planetary grinding with the ceramic-bonded diamond wheel is suitable for the rapid thinning and flattening of the sapphire substrate.

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“…(4) Kim et al used a sapphire wafer to estimate the rate of material removal by lapping. (5) Their three-body wear model comprised a diamond slurry on metal resin-bound lapping plates made of copper, aluminum, or zinc powder. Metal-resin plates combined with abrasives were also used.…”

Section: Introductionmentioning

confidence: 99%

“…The Ra values obtained using 9 μm diamond abrasives with a copper-resin, aluminumresin, zinc-resin, and fixed diamond plates were 38.03, 25.28, 19.03, and 69.50 nm, respectively. (5) Velden mentioned in his report that 3M Company used polishing pads with fixed abrasives and that a nonpolishing slurry chemical mechanical polishing (CMP) was used. (6) The polishing pad was impregnated with abrasives, which promoted grinding efficiency, and the surface flatness was three times better than in a free-abrasive process.…”

Section: Introductionmentioning

confidence: 99%

Development of Combined Diamond-impregnated Lapping Plates

Tsai¹,

Lin²,

Lin³

2018

Sensors and Materials

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Single-crystal silicon carbide (SiC) wafers for use in semiconductor chip production are a next-generation material. SiC will be the power-saving, high-energy-transforming, and hightemperature working element of the future. However, SiC is a very difficult material to process because of its exceptional hardness and chemical stability. Conventional polishing takes an enormous amount of time, and is inefficient and very costly. An improved process is urgently needed to reduce cost and raise efficiency. In this paper, we present a diamond lapping wheel for SiC to improve the material removal rate. Four kinds of diamond wheel were fabricated using two types of binder material (resin and ceramic) and two sizes of diamond (1 and 6 μm). The surface roughness and material removal rates of SiC wafer samples, using each of the diamond laps, were investigated. The experimental results showed that the rate of material removal using the ceramic wheel binder was higher than that using the resin-bound wheels. In addition, the ceramic diamond wheel gave a better surface finish. These results clearly indicated that the diamond laps were effective and could be used for SiC lapping.

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Comparison between sapphire lapping processes using 2-body and 3-body modes as a function of diamond abrasive size

Cited by 43 publications

References 29 publications

Developing an Analytical Model and Computing Tool for Optimizing Lapping Operations of Flat Objects Made of Alloyed Steels

Developing an Analytical Model and Computing Tool for Optimizing Lapping Operations of Flat Objects Made of Alloyed Steels

Evaluation of Double-Sided Planetary Grinding Using Diamond Wheels for Sapphire Substrates

Development of Combined Diamond-impregnated Lapping Plates

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