Comparison in performance by emulsion and SiC nanofluids HS-WEDM multi-cutting process

Guo, Cuixia; Wu, Zhangyong; Wang, Xing; Zhang, Jianping

doi:10.1007/s00170-021-07600-7

Cited by 8 publications

(3 citation statements)

References 38 publications

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“…The emulsion dielectric was a liquid mixed with emulsion cream and distilled water in a weight ratio of 1:60. The emulsion-SiC nano uids were prepared by dispersing SiC nanoparticles with 50 nm diameter into emulsion as the base uid using a two-step method [24]. The wire electrode was a molybdenum wire with 0.18 mm diameter.…”

Section: Methodsmentioning

confidence: 99%

“…The average cutting speed was calculated using Eq. (1) [24]: Average cutting speed (mm 2 /min)= (Cutting length × Workpiece thickness)/Machining time (1) Table 2 Machining process of the Trim2, the kerf width of three cutting and surface appearance of the samples…”

Section: Methodsmentioning

confidence: 99%

“…Therefore, the compression capacity of the discharge channel in the gas-liquid dual dielectric was larger than that in the dry method and smaller than that in the conventional top and bottom ushing method, so that the discharge gap was also between the two. Compared with the moistened wire with the emulsion method, the moistened wire with emulsion-SiC nano uids had a smaller discharge gap is due to the discharge energy is dispersed for the SiC nanoparticles [24].…”

Section: Discharge Gapmentioning

confidence: 99%

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Comparative study on near-dry wire-cut electrical discharge machining process using moistened wire

Xie,

Guo,

Wang

et al. 2023

Int J Adv Manuf Technol

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The disturbance of ushing to the electrode wire exists in conventional top and bottom ushing process and the machined surface easily being burned in the dry process, a novel dielectric uid feeding method (moistened wire method) with near-dry high-speed reciprocating wire electrical discharge machine (HS-WEDM) was proposed. A dielectric uid was poured onto a drum to achieve a moistened wire and packed into the discharge gap by a high-speed running molybdenum wire, and form a gas-liquid double-layer dielectric for discharge machining, cooling and cleaning for the working material. The effect of four processing (conventional top and bottom ushing with emulsion, the dry with atmospheric, the moistened wire with emulsion and moistened wire with emulsion-SiC nano uids) during the nishing process on the kerf width, average cutting speed, surface roughness, surface morphology, and corner accuracy of the Cr12MoV die steel was studied. Compared to the conventional top and bottom ushingprocess, the moistened wires with emulsion and emulsion-SiC nano uid processes maintained the high cutting speeds and obtained smooth machined surfaces. The Ra values decreased by 39.8% and 45.8%, the inner circle radius decreased by 4.1% and 4.9%, and outer circle radius decreased by 3.4% and 10.3%, respectively. The results showed that the moistened wire process improved the machined surface quality and corner accuracy of 90° pro le without sacri cing the average cutting speed due to their moderate discharge gaps. Compared with the moistened wires with emulsion process, the moistened wires with emulsion-SiC nano uid process further improved machined quality with lower surface roughness and corner error.

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Section: Methodsmentioning

confidence: 99%

Section: Methodsmentioning

confidence: 99%

Section: Discharge Gapmentioning

confidence: 99%

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