27th European Mask and Lithography Conference 2011
DOI: 10.1117/12.895198
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Comparison of cleaning processes with respect to cleaning efficiency

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Cited by 5 publications
(4 citation statements)
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“…The FDL is identified by the biggest feature that is damaged after extensive cleaning on a test mask containing many different feature sizes using our previously described test recipe [3]. The FDL is expected to rise with absorber thickness.…”
Section: Feature Damagementioning
confidence: 99%
“…The FDL is identified by the biggest feature that is damaged after extensive cleaning on a test mask containing many different feature sizes using our previously described test recipe [3]. The FDL is expected to rise with absorber thickness.…”
Section: Feature Damagementioning
confidence: 99%
“…The semiconductor industry, which requires a very high level of cleaning to realise yet smaller features, has their own definition for numbers that assessing cleaning performance, such as Particle Removal Efficiency (PRE), Feature Damage Limit (FDL), and Feature Damage Probability (FPD); [74] which are relevant for megasonic frequencies.…”
Section: Semiconductor Cleaningmentioning
confidence: 99%
“…Nevertheless, almost all physical cleaning techniques show that smaller particles are more difficult to remove in comparison to larger ones. 15 The reason for this discrepancy is that for most physical Comparison between the drag and collapse force of structures with an AR of 2 and 3.4 as function of the particle diameter. The drag forces are calculated for the minimum liquid velocity necessary for particle removal.…”
Section: Process Windowmentioning
confidence: 99%