Comparison of drop performance between the Sn37Pb and the Sn3.8Ag0.7Cu solder joints subjected to drop test

Zhang, Ning; Shi, Yaowu; Guo, Fu; Liu, Yongping; Xia, Zhidong; Chen, Zhenhua; Li, Tian

doi:10.1007/s10854-010-0131-x

Cited by 3 publications

(1 citation statement)

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“…1,2 SnAgCu system lead free solder, which is considered as one of the most potential succedanea of SnPb solder, has been adopted now and is expected to be extensively used in the future due to its excellent comprehensive properties. [2][3][4] The preceding studies reveal that adding 0?1% rare earth (RE) in the solder can enhance the physical properties and creep strength of SnAgCu solder alloys. 5 In order to further improve the wettability, tensile strength and elongation of SnAgCuRE lead free solder, minor Ni has been added into the solder during manufacturing.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni on growing of intermetallic compound in interface of Sn2·5Ag0·7Cu0·1RE/Cu solder joint during aging

Zhang¹,

Qiu³

et al. 2012

Materials Science and Technology

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Aging treatment was implemented for the Sn2·5Ag0·7Cu0·1RExNi/Cu solder joint under various temperatures simulating the service environment. The growing behaviour of the intermetallic compound at the soldering interface during aging was investigated. In the case of adding 0·1Ni aged solder joint, the maximum growth activation energies of (Cu,Ni)6Sn5 and Cu3Sn are 86·8 and 93·7 kJ mol−1 respectively. The results reveal that the growth of intermetallic compound in the soldering interface can be suppressed, and the solder joint can be strengthened by adding proper quantities of Ni in the solder.

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