2013
DOI: 10.1155/2013/825195
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Comparison of H2and NH3Treatments for Copper Interconnects

Abstract: The surface state, electrical, and reliability characteristics of copper (Cu) interconnects after ammonia (NH3) or hydrogen (H2) plasma treatment were investigated in this study. The experimental results show that H2plasma treatment has excellent Cu oxide removal efficiency, less impact on the formation of Cu hillocks, and less damage on low-dielectric constant (low-k) dielectrics in comparison to NH3plasma treatment. However, H2plasma treatment results in a higher leakage current between the Cu lines and shor… Show more

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Cited by 12 publications
(7 citation statements)
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“…Deconvolution resulted in two peaks at 398.5 and 399.2 eV corresponding to N in g-C 3 N 4 , and the peak at 399.2 eV indicates the presence of Cu–N species in the composite in perfect agreement with earlier reports. 57 Further, the peak at about 401.0 eV could be due to the remaining amino groups present on the surface of the composite.…”
Section: Resultsmentioning
confidence: 98%
“…Deconvolution resulted in two peaks at 398.5 and 399.2 eV corresponding to N in g-C 3 N 4 , and the peak at 399.2 eV indicates the presence of Cu–N species in the composite in perfect agreement with earlier reports. 57 Further, the peak at about 401.0 eV could be due to the remaining amino groups present on the surface of the composite.…”
Section: Resultsmentioning
confidence: 98%
“…Hydrogen (H) atom is typically the reducing agent. Hence, H 2 or NH 3 is widely used reduction gas [60][61][62]. The chemical clean is processed under a plasma process, which increases the activity of the reaction.…”
Section: Cu Oxidationmentioning
confidence: 99%
“…The reduction in the OH concentration reveals the reduction of the oxygen radicals (as a result of the oxide reduction). Nevertheless, as the copper oxide cannot be completely removed, the peak does not decrease more with further treatment [43]. Figure 5(a) shows the copper foil used as a substrate before (up and down sample) and after (medium sample) the hydrogen etching and the graphene growth.…”
Section: Copper Oxide Reductionmentioning
confidence: 99%