I. INTRODUCTION B ROADBAND amplification of signals is desirable in many applications such as high-speed data communications, high-resolution imaging systems, optoelectronics and instrumentation systems. Wide bandwidth is one of the prominent factors to be considered in designing such a system since it determines ability of the system for transferring highdata-rate information, transmitting/receiving short pulses, or processing wideband signals. Designing broadband amplifiers has always been challenging. The ever-increasing demand for higher data-rates and low energy consumption in next generation communication systems further complicates the design of broadband amplifiers. Distributed amplifiers (DA), also known as travelling-wave amplifiers (TWA), are one of the most popular broadband amplifier architectures. The DA architecture was originally patented by Percival in 1936 [1] and later elaborated by Ginzton in 1948 [2]. The early DAs were implemented using vacuum tube technology. One of the first vacuum tube DAs fabricated in 1950 is shown in Fig. 1. The amplifier included three type 807 tubes and 482-Ω plate and grid lines. The amplifier achieved a gain of 11 dB, bandwidth of 100 Hz to 300 MHz, and a typical output power of 15 W [3]. The first Monolithic Microwave Integrated Circuit (MMIC) DA was demonstrated by Ayasli in 1982 [4] using a Gallium Arsenide (GaAs) MESFET technology. The amplifier, shown in Fig. 2, included four transistors with 1-µm gate length and 50-Ω input and output lines. It achieved 9-dB gain and 1-13 GHz bandwidth. GaAs remained the main technology for design of DAs until the inception of the first Indium Phosphide (InP) DA in 1990 [5] with an impressive bandwidth of 5-100 GHz. GaAs and InP semiconductor technologies have been predominantly employed in implementation of DAs. These technologies provide superior performance resulting from their high electron mobility, high saturated electron velocity, high breakdown voltage, and high-resistivity substrate. The later contributes to availability of low-loss integrated passive elements. The market demands for low cost, small size, and low power consumption of electronic systems has motivated researchers to develop techniques to implement distributed amplifiers using mainstream CMOS technologies. The first integrated CMOS DA was presented by Kleveland in 1999 [6]. Recently,