Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders

Li, J F; Mannan, Samjid H.; Clode, Michael; Chen, K; Whalley, D.C.; Liu, C; Hutt, David A.

doi:10.1016/j.actamat.2006.09.003

Cited by 56 publications

(40 citation statements)

References 18 publications

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“…The latter was thought to be related to effects of temperature on both dissolution and growth rates of IMCs. In the present case, it can be reasonably attributed to the highly scattered micro-cracks and pores within the Ni P layer, which have been described in detail elsewhere [25]. As shown in Fig.…”

Section: A Interfacial Reaction In Sn-bi/ni-p Systemsupporting

confidence: 54%

Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects

Mannan

Clode

et al. 2008

IEEE Trans. Comp. Packag. Technol.

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Section: A Interfacial Reaction In Sn-bi/ni-p Systemsupporting

confidence: 54%

Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects

Mannan

Clode

et al. 2008

IEEE Trans. Comp. Packag. Technol.

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“…2 a-c, which is similar to previous results. 15,27 However, the reaction products of the solid-state reaction are quite different from those of the liquid-state reaction; two IMC layers formed at the interface. Interfacial Reactions Between Sn-4Ag-3Zn and Ag Figure 4 shows a backscattering electron image of the interfaces between Sn-4Ag-3Zn and Ag substrates.…”

Section: Resultsmentioning

confidence: 99%

“…24 A considerable number of researchers have focused on the interfacial reactions between Cu or Ni and leadfree solders. [25][26][27][28][29] The effect of Cu addition on the interfacial reactions between Sn-9Zn and Ag substrates has also been investigated. 15 However, there are limited data about the interfacial reactions between Sn-4Ag-xZn and Ag substrates.…”

Section: Introductionmentioning

confidence: 99%

Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

Zou

Zhang

2008

Journal of Elec Materi

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In this study, the effect of Zn (Zn = 1 wt.%, 3 wt.%, and 7 wt.%) additions to Sn-4Ag solder reacting with Ag substrates was investigated under solid-state and liquid-state conditions. The composition and microstructure of the intermetallic compounds (IMCs) significantly changed due to the introduction of different Zn contents. In the case of Sn-4Ag solder with 1 wt.% Zn, a continuous Ag-Sn IMC layer formed on the Ag substrates; discontinuous Ag-Zn layers and Sn-rich regions formed on the Ag substrates under liquid-state conditions when the Sn-4Ag solders contained 3 wt.% and 7 wt.% Zn. If 3 wt.% Zn was added to Sn-4Ag solder, the Ag-Sn IMC would be transformed into a Ag-Zn IMC with increasing aging time. Rough interfaces between the IMCs and the Ag substrates were observed in Sn-4Ag-7Zn/Ag joints after reflowing at 260°C for 15 min; however, the interfaces between the IMCs and the Ag substrates became smooth for Sn-4Ag-1Zn/Ag and Sn-4Ag-3Zn/Ag joints. The nonparabolic growth mechanism of IMCs was probed in the Sn-4Ag-3Zn/Ag joints during liquid-state reaction, and can be attributed to the detachment of IMCs. On the other hand, the effect of gravity was also taken into account to explain the formation of IMCs at the three different interfaces (bottom, top, and vertical) during the reflow procedure.

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“…20 As previously mentioned, the reactive diffusion between the Sn-base solder and the electroless Ni-P has been experimentally studied by many investigators. [20][21][22][23][24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39] According to these studies, the enrichment of P in the Ni-P occurs owing to growth of Ni 3 Sn 4 and causes formation of Ni 3 P in the Ni-P adjacent to Ni 3 Sn 4 . In the case of the experiment by Li et al, 37) diffusion couples composed of electroless Ni-P Fig.…”

Section: Growth Behavior Of Ni 3 Snmentioning

confidence: 99%

“…[18][19][20] The Ni layer electrolessly deposited onto the Cu-base alloy usually contains 5-20 at% of P. The reactive diffusion between the electroless Ni-P layer and the Sn-base solder has been experimentally studied by many researchers. [20][21][22][23][24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39] However, a soldering technique has been used in most of these studies. In this technique, a diffusion couple is prepared from a molten Sn-base solder and a (Ni-P)/Cu conductor material at soldering temperatures, and then isothermally annealed at solid-state temperatures.…”

Section: Introductionmentioning

confidence: 99%

Solid-State Reactive Diffusion between Sn and Electroless Ni–P at 473 K

Yamakami

Kajihara

2009

Mater. Trans.

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Nickel-phosphorus alloys are electrolessly deposited onto Cu-base conductors to suppress formation of Cu-Sn compounds during soldering using Sn-base solders. However, a Ni-Sn compound is produced during soldering, and continuously grows during energization heating at solid-state temperatures. To examine influence of P on the growth behavior of the Ni-Sn compound during energization heating, the kinetics of the solid-state reactive diffusion between Sn and electroless Ni-P alloys was experimentally determined at 473 K in the present study. For the experiment, pure Cu sheets were electrolessly deposited with Ni-P alloys containing 4.6 at%, 18.5 at% and 20.4 at% of P, and then sandwiched between pure Sn plates. Such Sn/(Ni-P)/Cu/(Ni-P)/Sn diffusion couples were isothermally annealed at 473 K for various periods up to 1307 h. During annealing, a layer of Ni 3 Sn 4 is formed along the Sn/(Ni-P) interface in the diffusion couple. The annealing time dependence of the mean thickness of the Ni 3 Sn 4 layer is expressed by a parabolic relationship. The parabolic coefficient slightly increases with increasing P concentration in the Ni-P. Thus, P in the Ni-P lightly accelerates the growth of Ni 3 Sn 4 at the interconnection between the Ni-P and the Sn-base solder. Using the experimentally determined values of the parabolic coefficient, the interdiffusion coefficient in Ni 3 Sn 4 was analytically evaluated by a mathematical model. The acceleration effect of P on the growth of Ni 3 Sn 4 is quantitatively explained by the dependence of the interdiffusion coefficient on the P concentration in the Ni-P.

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Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders

Cited by 56 publications

References 18 publications

Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects

Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects

Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

Solid-State Reactive Diffusion between Sn and Electroless Ni–P at 473 K

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Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders

Cited by 56 publications

References 18 publications

Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects

Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder Interconnects

Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

Solid-State Reactive Diffusion between Sn and Electroless Ni&ndash;P at 473 K

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Solid-State Reactive Diffusion between Sn and Electroless Ni–P at 473 K