2020
DOI: 10.1016/j.solmat.2020.110718
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Comparison of passivation properties of plasma-assisted ALD and APCVD deposited Al2O3 with SiNx capping

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Cited by 9 publications
(6 citation statements)
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“…As shown in Table 1 and Figure 5, excellent boron emitter passivation has been achieved by the activation of BSG passivation in this work. The results are comparable to the state‐of‐the‐art boron emitter passivation by Al 2 O 3 ‐based passivation 29,30 and various other dielectric layers (such as TiO 2, 24 SiO x /SiN x , 33 SiON/SiN x 34 and Al 2 O 3 /SiO x 22 ) on textured surfaces and similar boron emitters, as well as the conventional thermal SiO 2 on a polished surface, 23 thereby making it a strong candidate for boron emitter passivation in device applications.…”
Section: Resultsmentioning
confidence: 53%
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“…As shown in Table 1 and Figure 5, excellent boron emitter passivation has been achieved by the activation of BSG passivation in this work. The results are comparable to the state‐of‐the‐art boron emitter passivation by Al 2 O 3 ‐based passivation 29,30 and various other dielectric layers (such as TiO 2, 24 SiO x /SiN x , 33 SiON/SiN x 34 and Al 2 O 3 /SiO x 22 ) on textured surfaces and similar boron emitters, as well as the conventional thermal SiO 2 on a polished surface, 23 thereby making it a strong candidate for boron emitter passivation in device applications.…”
Section: Resultsmentioning
confidence: 53%
“…Measured J 0e as a function of boron emitter sheet resistance passivated by a BSG/SiN x /SiO x stack (this work) and compared with thermal SiO 2, 23 ALD TiO 2, 24 PEALD Al 2 O 3 /PECVD SiN x , 29 PECVD AlO x /SiN x stacks 30 . All results are on textured surfaces, except for thermal SiO 2 results which are on a polished surface…”
Section: Resultsmentioning
confidence: 99%
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“…By ALD, controllable thickness, uniformity, composition of the film and compatibility to most substrates can be realized at the same time. Furthermore, ALD can be used to prepare ultrathin films of many materials, such as oxides, nitrides, sulfides, carbides, fluoride and even polymers [41,42]. It is noteworthy that the ALD technology is usually carried out in vacuum at relatively low temperatures, with the help of which ALD could be applied to sensitive surface but free of pinholes, cracks and defects.…”
Section: Atomic Layer Depositionmentioning
confidence: 99%
“…In other photodiode fabrication technologies, oxides, such as MoO x and Al 2 O 3 , are used to introduce a negative fixed charge and create an inversion layer at the silicon/insulator interface [19]- [22]. Due to the insulating properties of oxides, the silicon/insulator interface is usually contacted via a doped Si region [20].…”
Section: Introductionmentioning
confidence: 99%