2019
DOI: 10.1109/tns.2019.2950199
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Comparison of Radiation Effects in Custom and Commercially Fabricated Resistive Memory Devices

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Cited by 3 publications
(2 citation statements)
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“…So far, hafnium oxide-based RRAM devices, have been proven to be robust against various types of radiation including X-rays [10,11], protons [10][11][12], gamma radiation [13,14] and heavy ions [15,16]. Heavy ion irradiation studies on Ti-and Taoxide-based RRAM devices [17][18][19][20][21][22] show different behaviors for different dielectrics among irradiation and correlate changes in device resistance mainly with the creation of oxygen vacancies. For hafnium oxide, however, only few studies consider effects of heavy ion irradiation on the crystalline structure of e.g.…”
Section: Introductionmentioning
confidence: 99%
“…So far, hafnium oxide-based RRAM devices, have been proven to be robust against various types of radiation including X-rays [10,11], protons [10][11][12], gamma radiation [13,14] and heavy ions [15,16]. Heavy ion irradiation studies on Ti-and Taoxide-based RRAM devices [17][18][19][20][21][22] show different behaviors for different dielectrics among irradiation and correlate changes in device resistance mainly with the creation of oxygen vacancies. For hafnium oxide, however, only few studies consider effects of heavy ion irradiation on the crystalline structure of e.g.…”
Section: Introductionmentioning
confidence: 99%
“…Proton irradiation induces displacement defects, which affect the behavior of charge carriers. Defects act as carrier traps, reducing the mobility and causing threshold voltage drift [30].…”
mentioning
confidence: 99%