Hafnium oxide- and GeSbTe-based functional layers are
promising
candidates in material systems for emerging memory technologies. They
are also discussed as contenders for radiation-harsh environment applications.
Testing the resilience against ion radiation is of high importance
to identify materials that are feasible for future applications of
emerging memory technologies like oxide-based, ferroelectric, and
phase-change random-access memory. Induced changes of the crystalline
and microscopic structure have to be considered as they are directly
related to the memory states and failure mechanisms of the emerging
memory technologies. Therefore, we present heavy ion irradiation-induced
effects in emerging memories based on different memory materials,
in particular, HfO
2
-, HfZrO
2
-, as well as GeSbTe-based
thin films. This study reveals that the initial crystallinity, composition,
and microstructure of the memory materials have a fundamental influence
on their interaction with Au swift heavy ions. With this, we provide
a test protocol for irradiation experiments of hafnium oxide- and
GeSbTe-based emerging memories, combining structural investigations
by X-ray diffraction on a macroscopic, scanning transmission electron
microscopy on a microscopic scale, and electrical characterization
of real devices. Such fundamental studies can be also of importance
for future applications, considering the transition of digital to
analog memories with a multitude of resistance states.