Comparison of TMA and ABES as forecasting systems of wood bonding effectiveness

Lecourt, Michaël; Pizzi, A.; Humphrey, Philip E.

doi:10.1007/s00107-002-0346-5

Cited by 34 publications

(14 citation statements)

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“…Using ABES, it is possible to control a range of parameters . It has also been proven that the results correlate well with TMA . The strength measurement is usually carried out immediately after hot pressing, whereby the adhesive joint is tested in hot condition.…”

Section: Introductionmentioning

confidence: 99%

“…4,5 It has also been proven that the results correlate well with TMA. 6 The strength measurement is usually carried out immediately after hot pressing, whereby the adhesive joint is tested in hot condition. In order to reduce the influence of thermoplastically induced softening for adhesives with pronounced thermoplastic behavior a rapid cooling phase is needed to reach moderate temperatures (~30 C) in the bond line.…”

Section: Introductionmentioning

confidence: 99%

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Thermoplastic and moisture‐dependent behavior of lignin phenol formaldehyde resins

Solt

Herwijnen

Konnerth

2019

J of Applied Polymer Sci

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Bonding kinetics of thermosetting adhesives is influenced by a variety of factors such as temperature, humidity, and resin properties. A comparison of lignin‐based phenol formaldehyde (LPF) and phenol formaldehyde (PF) adhesive in terms of reactivity and mechanical properties referring to testing conditions (temperature, moisture of specimen) were investigated. For this purpose, two resins were manufactured aiming for similar technological resin properties. The reactivity was evaluated by B‐time measurements at different temperatures and the development of bonding strength at three different conditions, testing immediately after hot pressing, after applying a cooling phase after hot pressing, or sample conditioning at standard climate. In addition, the moisture stability of the two fully cured resins was examined. The calculated reactivity index demonstrated that LPF requires more energy for curing than PF. Further results indicate that lignin as substituent for phenol in PF resin has a negative impact on its moisture resistance. Additionally, the known thermoplastic behavior of lignin could also be detected in the behavior of the cured resin. This behavior is relevant for the adhesive in use and necessitates a cooling phase before testing the bonding strength development of lignin‐based adhesive systems. © 2019 The Authors. Journal of Applied Polymer Science published by Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 48011.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Thermoplastic and moisture‐dependent behavior of lignin phenol formaldehyde resins

Solt

Herwijnen

Konnerth

2019

J of Applied Polymer Sci

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“…The second peak at higher temperature indicates that curing of the NIPU resin occurred at a high temperature, as already reported in previous literature for similar types of adhesives [ 32 , 33 ]. The increase of Young’s modulus has been shown to correlate with the bonding strength of the adhesive [ 37 , 38 , 39 , 40 , 41 , 42 ].…”

Section: Resultsmentioning

confidence: 99%

Non-Furanic Humins-Based Non-Isocyanate Polyurethane (NIPU) Thermoset Wood Adhesives

et al. 2021

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Predominantly non-furanic commercial humins were used to prepare humin-based non-isocyanate polyurethane (NIPU) resins for wood panel adhesives. Pure humin-based NIPU resins and tannin–humin NIPU resins were prepared, the latter to upgrade the humins’ performance. Species in the raw humins and species formed in the NIPU resins were identified by Matrix Assisted Laser Desorption Ionization Time of Flight (MALDI ToF) spectrometry and Fourier Transform Infrared (FTIR). Humins, fulvic acid and derivatives, humic acid and its fragments, some lignans present and furanic oligomers present formed NIPU linkages. Thermomechanical analysis (TMA) showed that as with other biomaterials-based NIPU resins, all these resins also showed two temperature peaks of curing, the first around 130 °C and the second around 220 °C. A decrease in the Modulus of Elasticity (MOE) between the two indicated that the first curing period corresponded to linear growth of the oligomers forming a physical entanglement network. This then disentangled, and the second corresponded to the formation of a chemical cross-linked network. This second peak was more evident for the tannin–humin NIPU resins. All the laboratory particleboard made and tested either bonded with pure humins or with tannin–humin NIPU adhesives satisfied well the internal bond strength requirements of the relevant standard for interior grade panels. The tannin–humin adhesives performed clearly better than the pure humins one.

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“…F1 resin with 15% bio hardener (V.nilotica), has a higher modulus of elasticity than F2 and F3 resins. The TMA results indicate that the best performance is estimated by the highest value of the MOE obtained [37,38]. F2 and F3 resins polymerize at practically the same temperature (100°C), faster than the bio-resin which polymerizes at 115°C, proving moreover that the 2,5-dihydroxymethylfuran in the exudates is slower-reacting than the aldehydes in synthetic hardeners.…”

Section: Thermomechanical Analysis Of Resinsmentioning

confidence: 94%

Untitled

2020

Journal of Nanotechnology and Smart Materials

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The spectroscopic and spectrometric methods such as MALDI TOF and FT MIR, thermomechanical analyzer and the Stiasny number were used to determine the adhesive performance of Monopetalanthus durandii tannin. This extract is a condensed tannin with the repetition of 62-64 Da corresponding to Chrysin (256 Da) and dicationized (2xNa+) form. The MOE of the bio adhesive developed using bio hardener at natural pH and its Stiasny number are respectively 6608.65 MPa and 74.2%.A UD biocomposite has been developed based this bio adhesive had very good tensile properties. Its tensile strength (MOR), young's modulus (MOE), yield strength (Rp 0.2 ) and plastic deformation (ε 0,2 ) are respectively 72 MPa; 8 GPa; 38.1 MPa and 0.7%.

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Comparison of TMA and ABES as forecasting systems of wood bonding effectiveness

Cited by 34 publications

References 0 publications

Thermoplastic and moisture‐dependent behavior of lignin phenol formaldehyde resins

Thermoplastic and moisture‐dependent behavior of lignin phenol formaldehyde resins

Non-Furanic Humins-Based Non-Isocyanate Polyurethane (NIPU) Thermoset Wood Adhesives

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