Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Abstract

Firm immobilization of catalysts on the predesigned position over substrates is an essential process for producing flexible circuits by the electroless deposition (ELD) process. In this work, a compatible Ag + complex was developed and directly printed on the poly(ethylene terephtalate) (PET) film through a micro inkjet printing instrument to trigger the deposition of ultrafine copper patterns with approximately 20 μm in width. Morphological and elementary characterization verified that the nanosized silver catalyst was uniformly distributed in the bridge layer, which could enhance the adhesion between the PET film and deposited copper patterns. Moreover, after 30 min of ELD, the copper patterns exhibited a low resistivity of 2.68 × 10 −6 Ω•cm and maintained considerable conductivity even after 2000 times of cyclical bending. These interesting conductive and mechanical features demonstrate the tremendous potential of this Ag + complex-assisted copper deposition in the interconnection of high-density integrated flexible electronics.

Stability Analysis: Rational Design of a Ag Nanoparticle/Polymer Brush for Fabricating Cu Coating on a PET Surface

“…In particular, fabrication of a Cu pattern on a PET surface is an essential and indispensable characteristic for applications of flexible electronics. It is also noted that in most reports the introduction of active groups, the adsorption of catalytic centers, and electroless plating (a three-step process) are the common technology methods used. − Huang et al, Wang et al, and Chang et al have found that the modified PET surface with −NH 2 and −SH on its surface could absorb Ag particles, such that the Cu coatings are deposited through a REDOX reaction in the presence of catalytic centers. Generally, the catalyst particles, such as Au, Pd, Ag, and so on, are adsorbed and then anchored on the surface of the modified substrate through a coordinate bond.…”

A Facile Method Combined with Acetic Acid Modification and Electroless Plating to Fabricate Copper-plated Nylon 12 Powder for Antistatic Coating

“…Electroless plating is free electrochemical deposition method, which is widely used in fabricating metal/polymer composite material. The development of electroless plating has drawn extensive attention mainly because it is a simple and promising method to prepare surface-metallization material [1,2]. Metal particles, such as Ag [3], Cu [4] and Ni [5], in-situ plated on substrate surface with excellent interfacial characterization and dispersion, which meet all the requirements on filler of antistatic coating [6].…”

Electroless Deposition to Fabricate Radiation Protection Suits for Pregnant Women: Effect of Water Bath Temperature on the Electromagnetic Shielding Performance

“…[6][7][8] Electroless plating (EP) is a free electrochemical deposition method, which is widely used in fabricating metal/polymer composite material due to its reliable capability for large-area deposition, less restriction in surface topography and requirement for expensive facility. [8][9][10] Chen et al reported silvercoated carbon fabric composites have been successfully fabricated by using electroless silver plating. [10] It is also noted that in most reports, the introduction of active groups, the adsorption of catalytic centers and electroless plating are the common technology.…”

“…[10] It is also noted that in most reports, the introduction of active groups, the adsorption of catalytic centers and electroless plating are the common technology. [5][6][7][8][9][10][11] Kwak et al designed and prepared a broadband microwave-absorbing honeycomb core structure using a EP-Ni on glass fabric, which can absorb the EM waves propagating along three orthogonal directions. [12] Lu et al fabricated a Cu-plated bamboo fabric composite that displayed a excellent EMI shielding effectiveness of 55 dB.…”