Compensation Linear Acceleration Converter Based on Optical Tunneling

Бусурин, В. И.; Korobkov, Kirill A.; Shleenkin, Lev A.; Makarenkova, Nadezhda A.

doi:10.23919/icins43215.2020.9133810

Cited by 3 publications

(1 citation statement)

References 3 publications

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“…At the same time, the requirements for the mass and dimension parameters of the produced equipment are getting more and more complicated. Increasing integration of integrated circuits leads to higher density of leads on the package, which drives the search for new design solutions in their layout [1][2][3].…”

Section: Introductionmentioning

confidence: 99%

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs

Korobkov,

Vasilyev,

Khomutskaya

2023

Inventions

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Currently, there is a need to increase the density of interconnections on printed circuit boards (PCBs). Does this mean that the only option for quality PCB manufacturing is to proportionally increase precision of equipment, or is there another way? One of the main constraints on increasing the density of PCB interconnections is posed by the transition holes. As the number of conductive layers increases, the number of vias increases and they cover a significant space on the PCB. On the other hand, reducing the size of the vias is limited by the capability of spatial alignment of the PCB stack during manufacturing. There are standards that set limits for the design of contact pads on a PCB (IPC-A-600G, IPC-6012B). However, depending on the precision of production, the contact pads may be of poor quality. This raises the issue of determining the reliability of a contact pad with defined parameters at the design stage, taking into account manufacturing capabilities. This research proposes an analytical method for evaluation of reliability of a via or plated through-hole based on calculation of its probability of production in accordance with the current standards. On the basis of the method, a model was developed both for the case of a contact pad without any conductors connected to it (nonfunctional contact pad) and for the real case with a connected conductor. The model estimates the probability of making an acceptable via for a given reliability class depending on parameters such as the conductor width (minimum permissible and usable), drilled hole diameter, and pad diameter, as well as the accuracy of the drilling operation. The analysis of the modeling results showed that for the real case, a reduction in the reliability class would insignificantly affect the probability of making an acceptable via due to the tight limitation on the connection place of the conductor and the contact pad. In conclusion, we propose an algorithm for determining the optimal parameters of teardrops to minimize the negative impact of the conductor on the reliability of the vias.

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Section: Introductionmentioning

confidence: 99%

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs

Korobkov,

Vasilyev,

Khomutskaya

2023

Inventions

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Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on the PCB

Korobkov,

Vasilyev,

Khomutskaya

2023

Preprint

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Nowadays there is a need to increase the density of interconnections on printed circuit boards (PCBs). Does this mean that the only way out for quality PCB manufacturing is to proportional increase in precision of equipment, or is there another way? One of the main constraints to increasing the density of PCB interconnections is the transition holes. As the number of conductive layers increases, the number of vias increases and they cover a significant space on the PCB. On the other hand, reducing the size of the vias is limited by the capability of spatial alignment of the PCB stack during manufacturing. There are standards that set limits for the design of contact pads on a PCB (IPC-A-600G, IPC-6012B). However, depending on the precision of production, the contact pads may be of poor quality. This raises the issue of determining the reliability of a contact pad with defined parameters at the design stage, taking into account manufacturing capabilities. This research proposes an analytical method for evaluation of reliability of a via or plated through-hole based on calculation of its probability of production in accordance with the current standards. On the basis of the method a model was developed both for the case of a contact pad without any conductors connected to it (nonfunctional contact pad) and for the real case with a connected conductor. The model estimates the probability of making an acceptable via for a given reliability class depending on parameters such as the conductor width (minimum permissible and usable), drilled hole diameter and pad diameter, as well as the accuracy of the drilling operation. The analysis of the modeling results showed that for the real case, a reduction in the reliability class would insignificantly affect the probability of making an acceptable via due to the tight limitation on the connection place of the conductor and the contact pad. In conclusion, we propose an algorithm for determining the optimal parameters of teardrops to minimize the negative impact of the conductor on the reliability of the vias.

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A Comparative Analysis of Printed Circuit Boards with Surface-Mounted and Embedded Components under Natural and Forced Convection

Korobkov

Vasilyev

Mozharov³

2022

Micromachines

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This article is dedicated to the research of the physical reliability of electronic devices. It consists of a comparative thermal analysis of the cooling efficiency of a surface-mounted and an embedded component on a printed circuit board. A simulated finite element model of heat distribution over a printed circuit board with a surface component was constructed. An experiment confirmed the objectivity of the modeling results. The component’s temperature was then analyzed depending on the installation method (surface and embedded) and the cooling method (natural and forced with varying airflow velocities). The results showed that the temperature of the embedded component was less than the temperature of the surface-mounted component under natural convection and, in most cases, under forced convection (with an airflow velocity of forced cooling under 16 ms).

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Compensation Linear Acceleration Converter Based on Optical Tunneling

Cited by 3 publications

References 3 publications

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on the PCB

A Comparative Analysis of Printed Circuit Boards with Surface-Mounted and Embedded Components under Natural and Forced Convection

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