Compensation of the anisotropic behavior of single crystalline silicon in a 3D tactile sensor

Bos, Ejc Edwin; Heldens, Rwp; Delbressine, Flm Frank; Schellekens, Phj Piet; Dietzel, Andreas

doi:10.1016/j.sna.2006.05.043

Cited by 21 publications

(13 citation statements)

References 14 publications

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“…A microprobe suspended using three silicon slender rods, each with metallic piezo resistive strain gauges in a Wheatstone bridge configuration was developed, thus enabling accurate measurements [13]. An optimization by rods of different stiffnesses revealed systems isotropic in X-Y but still anisotropic (6:1) with respect to z-direction [14].…”

Section: Introductionmentioning

confidence: 99%

3D piezoresistive silicon microprobes with stacked suspensions for tailored mechanical anisotropies

Metz

Ferreira

Dietzel

2017

Sensors and Actuators A: Physical

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Different kinds of piezoresistive microprobes based on silicon have been developed to enable measurement with high accuracies. However, the typical mechanical anisotropy of such systems leads to the slip of the tip, when probing inclined surfaces. Here, a novel microprobe design is presented, which can be tailored to provide a range of anisotropy or even a perfect isotropy. In the first approach, the microprobe is composed of two stacked silicon membranes. In the second approach, a stainless steel suspension in the form of a laser structured foil is stacked on a silicon membrane. Geometrical parameter studies were carried out by mechanical FEM simulations to determine their influence on the stiffnesses in all spatial directions and to predict anisotropies. Microsystems with selected geometries were fabricated and stacking was obtained through selective adhesive transfer and bonding on a wafer level. Prototypes with anisotropies between 3 and 0.4 were characterized confirming the simulations.Keywords -3D micro probing system, piezo-resistive effect, tactile coordinate measurement, laser structuring, wafer-level bonding and tailored mechanical anisotropy.I.

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Section: Introductionmentioning

confidence: 99%

3D piezoresistive silicon microprobes with stacked suspensions for tailored mechanical anisotropies

Metz

Ferreira

Dietzel

2017

Sensors and Actuators A: Physical

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“…While the fabrication processes for these materials are well established, their material properties limit their use as valving membranes. The typical young modulus values of Si based materials range from values above 130 GPa (depending on their crystal orientation) (Bos et al 2007). Although such valves have advantages such as low permeability and high operational robustness, they are less suitable for valving di-phasic particulate fluids; particulate matter near the valve recess can prevent proper functioning of the valve.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and testing of embedded microvalves within PMMA microfluidic devices

Toh

Wang

2009

Microsyst Technol

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The integration of a PDMS membrane within orthogonally placed PMMA microfluidic channels enables the pneumatic actuation of valves within bonded PMMA-PDMS-PMMA multilayer devices. Here, surface functionalization of PMMA substrates via acid catalyzed hydrolysis and air plasma corona treatment were investigated as possible techniques to permanently bond PMMA microfluidic channels to PDMS surfaces. FTIR and water contact angle analysis of functionalized PMMA substrates showed that air plasma corona treatment was most effective in inducing PMMA hydrophilicity. Subsequent fluidic tests showed that air plasma modified and bonded PMMA multilayer devices could withstand fluid leakage at an operational flow rate of 9 ll/min. The pneumatic actuation of the embedded PDMS membrane was observed through optical microscopy and an electrical resistance based technique. PDMS membrane actuation occurred at pneumatic pressures of as low as 10 kPa and complete valving occurred at 14 kPa for *100 lm by 100 lm channel cross-sections.

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“…In recent years coordinate measuring machines (CMM) have been constructed for direct metrological characterization of high aspect-ratio microstructures (Bos et al, 2004;Bos et al, 2007;Küng et al, 2007;Peggs et al, 1999;Seitz, 2005;Tibrewala et al, 2008). For narrow holes actively sensing probing elements were developed which were scaled down to diameters of 120 -300 µm.…”

Section: Introductionmentioning

confidence: 99%

Compliant Tactile Sensors for High-Aspect-Ratio Form Metrology

Peiner¹

2008

Sensors: Focus on Tactile Force and Stress Sensors

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Compensation of the anisotropic behavior of single crystalline silicon in a 3D tactile sensor

Cited by 21 publications

References 14 publications

3D piezoresistive silicon microprobes with stacked suspensions for tailored mechanical anisotropies

3D piezoresistive silicon microprobes with stacked suspensions for tailored mechanical anisotropies

Fabrication and testing of embedded microvalves within PMMA microfluidic devices

Compliant Tactile Sensors for High-Aspect-Ratio Form Metrology

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