2012 IEEE International Frequency Control Symposium Proceedings 2012
DOI: 10.1109/fcs.2012.6243717
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Compensation, tuning, and trimming of MEMS resonators

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Cited by 19 publications
(4 citation statements)
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“…This effect is attributed to the major differences among the physical properties of the quartz and the soot (e.g. ρ qz ~ 2.65 g cm −3 , while ρ soot ~ 0.04-0.07 g cm −3 [33,38]), likely leading to different thermal expansion coefficients and subsequent partial thermal compensation [39]. Second, the coating deforms the shape of the TFC from linear to quasilinear (for the chosen temperature range) with random upward and downward signal drifts most probably caused by stress relaxation phenomena (e.g.…”
Section: Dynamic Tfc Of the Soot Coated Qcmsmentioning
confidence: 99%
“…This effect is attributed to the major differences among the physical properties of the quartz and the soot (e.g. ρ qz ~ 2.65 g cm −3 , while ρ soot ~ 0.04-0.07 g cm −3 [33,38]), likely leading to different thermal expansion coefficients and subsequent partial thermal compensation [39]. Second, the coating deforms the shape of the TFC from linear to quasilinear (for the chosen temperature range) with random upward and downward signal drifts most probably caused by stress relaxation phenomena (e.g.…”
Section: Dynamic Tfc Of the Soot Coated Qcmsmentioning
confidence: 99%
“…Once deposited onto the quartz surface they will cause a change in the shape of the TFC. Recently, the expansion coefficient differences have been used for temperature compensation of MEMS resonators [25]. Since, also in this study, each HMDSO film thickness was expected to introduce a different temperature sensitivity of the QCM, for more comprehensive comparison of the overall temperature stability of each device, we introduced a thermal sensitivity criterion called "100 K temperature stability" (100 KTS).…”
Section: Temperature Stability Criterionmentioning
confidence: 99%
“…However, they have had limited success in replacing their quartz counterparts in high-end applications; the bottleneck being the lack of temperature stability and frequency scalability with feasible motional impedance, especially at higher frequencies in the VHF range. In order to overcome the temperature variations, many methods are used 1 , some of which include using compound materials 2 and using highly doped silicon substrates 3,4 . Using compound materials usually involves complicated fabrications process, leading to higher cost and lower manufacturability.…”
Section: Introductionmentioning
confidence: 99%