1994
DOI: 10.2172/10132872
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Compilation of diamond-like carbon properties for barriers and hard coatings

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Cited by 4 publications
(9 citation statements)
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References 19 publications
(31 reference statements)
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“…After the deposition of DLC layers, the samples were tested for analyzing chemical attacks or formation on the substrate surface by using acid drops (Figure 3). The principal tests were produced by applying one layer of 1 μm to 2 μm thickness of DLC deposited on the Al substrates [87]. Further investigation was carried out for enhancing the substrate surface and deploying the SEM test examination to identify the stress cracking on the substrate surface.…”
Section: Chemical Resistance Of Dlc Coatingsmentioning
confidence: 99%
See 3 more Smart Citations
“…After the deposition of DLC layers, the samples were tested for analyzing chemical attacks or formation on the substrate surface by using acid drops (Figure 3). The principal tests were produced by applying one layer of 1 μm to 2 μm thickness of DLC deposited on the Al substrates [87]. Further investigation was carried out for enhancing the substrate surface and deploying the SEM test examination to identify the stress cracking on the substrate surface.…”
Section: Chemical Resistance Of Dlc Coatingsmentioning
confidence: 99%
“…None of the coatings was completely free from the inclusion of undesirable particles. The thicker coating was moderately resistant to chemical formation compared to thinner coatings; since they expanded the ideal opportunity for acid permeation through the layer [87] (see Figure 3). For instance, with the thinner coatings, the response between the Al substrate and the acid was immediate.…”
Section: Chemical Resistance Of Dlc Coatingsmentioning
confidence: 99%
See 2 more Smart Citations
“…The substrates were ultrasonically cleaned for 6 min in acetone followed by 6 min of ultrasonic cleaning in ethanol and dried with a compressed filtered airflow. We grew a Cr/CrN interlayer to improve the DLC coating adhesion to the substrates using the same deposition setup [40]. For the Cr layer, the RF magnetron sputtering technique was used (200 W RF discharge power), while reactive sputtering was employed to deposit a CrN film (200 W RF discharge power, 5 sccm N 2 flow), for a total thickness of 200 nm.…”
Section: Introductionmentioning
confidence: 99%