Complementing or replacing silicon and III–Vs: The role of plasmonics and novel materials in future integrated photonics for telecom and interconnects

Abstract

Integrated photonics has largely been based on silicon/silica and III-Vs in recent times. Both have their advantages and disadvantages, but neither seem capable of supporting a further significant reduction of device footprint to sustain the exponential decrease of this important parameter that we have witnessed since decades. The talk will analyze different aspects of plasmonics from this and a functionality point of view and further discuss some possible alternative materials.