1981
DOI: 10.1016/0040-6090(81)90662-3
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Complete thin film system for hybrid circuits sputtered with the plasmatron

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1982
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Cited by 9 publications
(2 citation statements)
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“…Moreover, TaN exhibits a range of low to high negative TCR [2] values, whereas films with near-zero TCR are reported for Ni-Cr [3]. Much work has been published on Ni-Cr films in discrete resistors [4,5]. The TCR control of the Ni-Cr resistors by using Au, Al and O 2 as dopants in films has been extensively discussed [6,7].…”
Section: Introductionmentioning
confidence: 98%
“…Moreover, TaN exhibits a range of low to high negative TCR [2] values, whereas films with near-zero TCR are reported for Ni-Cr [3]. Much work has been published on Ni-Cr films in discrete resistors [4,5]. The TCR control of the Ni-Cr resistors by using Au, Al and O 2 as dopants in films has been extensively discussed [6,7].…”
Section: Introductionmentioning
confidence: 98%
“…1) Ni-Cr alloy thin films are generally used for high precision thin film resistors because of their low TCR, high stability and reliability, and therefore, various researches and developments have been reported especially focused on the thin film preparation process and material composition regarding the resulting physical/electrical properties. [7][8][9] Although early studies on the Ni-Cr alloy thin films have mainly been done using evaporation techniques, recent developments of them are based on sputtering process because reproducibility of the resulting thin films could be hardly achieved in the evaporation process due to vaporization pressure difference of Ni and Cr atoms. Consequently, various studies on the TCR and specific resistivity characteristics of the Ni-Cr binary alloys with Al, Cu, Si, Mn, and Mo additives have been reported [2][3][4][5][6] as well as thin film property characterization after high temperature post-deposition annealing.…”
Section: Introductionmentioning
confidence: 99%