Complex Structures in Microwave Circuits by Using Additive Manufacturing Techniques

García-Martínez, Héctor; Torregrosa‐Penalva, Germán; Ávila-Navarro, Ernesto; Coves, Á.; Bronchalo, E.

doi:10.23919/eumc.2019.8910748

Cited by 3 publications

(1 citation statement)

References 10 publications

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“…Recently, some articles have been published on periodic structures in Substrate Integrated Waveguide (SIW) [25], [26] and in rectangular waveguide devices [27] or Single-Ridge Waveguide (SRW) [28]. The main drawbacks in these works are the high return losses that occur when using this type of structure and the attenuation caused by the presence of the dielectric.…”

Section: Introductionmentioning

confidence: 99%

3D-Printed Electromagnetic Band-Gap Band-Pass Filter Based on Empty Single-Ridge Waveguide

et al. 2022

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Section: Introductionmentioning

confidence: 99%

3D-Printed Electromagnetic Band-Gap Band-Pass Filter Based on Empty Single-Ridge Waveguide

et al. 2022

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Multilayered additive-manufactured half-wavelength coupled line filters

García-Martínez

Ávila-Navarro

Torregrosa‐Penalva

et al. 2020

AEU - International Journal of Electronics and Communications

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Implementation of Microwave Circuits Using Stereolithography

et al. 2022

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In this work, the use of additive manufacturing techniques through stereolithography for the manufacture of high-frequency circuits and devices is presented. Both the resin and the 3D printer used in this research are general-purpose commercial materials, not specifically intended for the implementation of microwave networks. The manufacturing and metallization procedures used to produce substrates for the design of planar microwave circuits are described, introducing the characterization process carried out to determine the electrical properties of the resin used. The ultrasonic techniques that allow the structural analysis of the manufactured substrates are also described. The electrical characterization provides a relative dielectric permittivity of 3.25 and a loss tangent of 0.03 for the resin used. In addition, the structural analysis shows a homogeneity and a finish of the manufactured parts that is not achievable using fused deposition modeling techniques. Finally, as a proof of concept, the design and manufacture of a complex geometry stepped impedance filter on a multi-height substrate using stereolithography techniques is presented, which allows for reducing the size of the traditional implementation of the same filter while maintaining its high-frequency response performance.

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Complex Structures in Microwave Circuits by Using Additive Manufacturing Techniques

Cited by 3 publications

References 10 publications

3D-Printed Electromagnetic Band-Gap Band-Pass Filter Based on Empty Single-Ridge Waveguide

3D-Printed Electromagnetic Band-Gap Band-Pass Filter Based on Empty Single-Ridge Waveguide

Multilayered additive-manufactured half-wavelength coupled line filters

Implementation of Microwave Circuits Using Stereolithography

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