2014
DOI: 10.1016/j.spmi.2014.04.016
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Composite HfO2/Al2O3-dielectric AlGaAs/InGaAs MOS-HEMTs by using RF sputtering/ozone water oxidation

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Cited by 11 publications
(5 citation statements)
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“…In order to attain low power consumption and high conversion efficiency, high breakdown voltage, leakage suppression, and high on/off current ratio are crucial. Meanwhile, the metal-oxide-semiconductor (MOS) structure can achieve a high breakdown voltage and on/off current ratio because the gate insulator effectively prevents the gate leakage and suppresses the surface leakage [19,20].…”
Section: Introductionmentioning
confidence: 99%
“…In order to attain low power consumption and high conversion efficiency, high breakdown voltage, leakage suppression, and high on/off current ratio are crucial. Meanwhile, the metal-oxide-semiconductor (MOS) structure can achieve a high breakdown voltage and on/off current ratio because the gate insulator effectively prevents the gate leakage and suppresses the surface leakage [19,20].…”
Section: Introductionmentioning
confidence: 99%
“…Also, AlGaN/GaNbased MOSHEMT is more suitable for high power and high-frequency electronic device applications than conventional HEMT-based devices due to their low gate capacitance and low gate leakage current. Today, Al 2 O 3 [9], [10], HfO 2 [11], [12], SiO 2 [13], [14], Si 3 N 4 [14], or La 2 O 3 [13], [14] materials are commonly used as the gate dielectric for AlGaN/GaN MOSHEMTs. AlGaN/GaN HEMT and MOSHEMTbased devices suffer from high contact and high ON-resistance because of metallic ohmic contacts and substantial source-to-drain distance.…”
Section: Introductionmentioning
confidence: 99%
“…The built in composite semiconductor HEMTs devise remains to be widely used for the application of the devices with lower-noise immune, higher voltage, and power-switching characteristics of the microwave/ millimeter-wave Integrated Circuit ( [1][2]. Nevertheless, the gate leakage challenges in thermionic release at barrier of a Schottky-gate due to elevation electric fields and surface charger at the barrier of gate-drain regional behavior would remarkably reduce the device performance.…”
Section: Introductionmentioning
confidence: 99%
“…There are varies types of gate dielectric materials have be employed in the MOS-gate device to improve the gate insulated driving capability. By accounting varies dielectric impact in MOS-HEMT devices along with different gate dielectric material are studied by including many processing varying parameter in the performances too be deliberate in future Ga based devices .This work given as better insight to the MOS-HEMTs with different compound HfO 2 /Al 2 O 3 dielectric layers to designed for power application in RF regime [1][2][3][4][5][6][7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%