Composite Materials: Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics (Adv. Funct. Mater. 45/2019)

Shi, Yingli; Wang, Chengjun; Yin, Yafei; Li, Yuhang; Xing, Yufeng; Song, Jizhou

doi:10.1002/adfm.201970314

Cited by 9 publications

(11 citation statements)

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“…[ 25 ] On the other hand, the incorporation of a thin metal film within (or on top of) the SCO layer could help to spread the heat dissipation along in‐plane directions, resulting in an increased thermal exchange surface. [ 26 ] The issue of low thermal conductivity, which constitutes a recurrent impediment for most PCMs, may be also addressed through the dispersion of high‐conductivity nanostructures (carbon nanotubes, metallic particles, etc.) into the SCO material [ 27 ] or, vice versa, by incorporating SCO particles in a porous metal foam or other high‐thermal‐conductivity matrices.…”

Section: Figurementioning

confidence: 99%

Heat Capacity and Thermal Damping Properties of Spin‐Crossover Molecules: A New Look at an Old Topic

et al. 2020

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The thermally induced spin‐crossover (SCO) phenomenon in transition metal complexes is an entropy‐driven process, which has been extensively studied through calorimetric methods. Yet, the excess heat capacity associated with the molecular spin‐state switching has never been explored for practical applications. Herein, the thermal damping effect of an SCO film is experimentally assessed by monitoring the transient heating response of SCO‐coated metallic microwires, Joule‐heated by current pulses. A damping of the wire temperature, up to 10%, is evidenced on a time scale of tens of microseconds due to the spin‐state switching of the molecular film. Fast heat‐charging dynamics and negligible fatigability are demonstrated, which, together with the solid‐solid nature of the spin transition, appear as promising features for achieving thermal energy management applications in functional devices.

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Section: Figurementioning

confidence: 99%

Heat Capacity and Thermal Damping Properties of Spin‐Crossover Molecules: A New Look at an Old Topic

et al. 2020

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“…Various inserts, electronics, or other layers have been embedded or added to composite materials via integrated or additive manufacturing. Such parts include embedded sensors in structural composites, , stretchable electronic circuits embedded in soft matrix, embedded phase-change material in functional soft composite, and very recently embedded batteries in the foam of sandwich composites …”

Section: Introductionmentioning

confidence: 99%

“…30 Various inserts, electronics, or other layers have been embedded or added to composite materials via integrated or additive manufacturing. Such parts include embedded sensors in structural composites, 31,32 stretchable electronic circuits embedded in soft matrix, 33 embedded phase-change material in functional soft composite, 34 and very recently embedded batteries in the foam of sandwich composites. 35 The innovative structural supercapacitor design proposed in this study comprises a sandwich structured composite, with embedded supercapacitors in the skins and integrated supercapacitors in the honeycomb core where the aluminum faces of the core constitute the current collectors of the supercapacitor-functional core.…”

Section: Introductionmentioning

confidence: 99%

A High-Performance Structural Supercapacitor

Reece

Lekakou

Smith

2020

ACS Appl. Mater. Interfaces

105

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Considering the low specific capacitance of structural solid supercapacitors, which is due to the low ion diffusivity in solid electrolytes and the small specific surface area of some structural electrodes such as carbon fiber fabrics, novel structural supercapacitor designs are proposed and evaluated in this study based on supercapacitor-functional sandwich composite materials. Typical electrochemical double layer capacitors (EDLCs) are proposed with liquid organic electrolyte 1 M TEABF4 in PC (propylene carbonate). In the innovative sandwich structured composites, supercapacitors are embedded in the skins and integrated in the honeycomb core where the aluminum faces of the core constitute the current collectors of the supercapacitor-functional core. The sandwich composite material exhibited a flexural modulus of 5.07 GPa and a flexural strength of 413.9 MPa. The EDLCs embedded in the skins increased the skin flexural modulus and strength by 47% and 56%, respectively, for embedded lateral EDLCs, and by 91% and 106%, respectively, for embedded lateral and longitudinal EDLCs. Compared to typical EDLCs with the same electrolyte, the structural supercapacitors in this study demonstrated superior specific electrode capacitance, C sp,el = 153 F g–1 for the honeycomb supercapacitor and C sp,el = 95.7 F g–1 for the skin supercapacitor, translating to overall structural composite material performance of 0.68 Wh/m2 honeycomb and 30.5 W/m2 honeycomb for the supercapacitor-functional honeycomb, and 0.02 Wh/m2 skin and 5.4 W/m2 skin for the supercapacitor-functional skin.

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“…Polymer materials are widely used in the fields of aerospace, electronics, surface coating, insulating materials, semiconductor encapsulation, and laminated composite because of their advantages in excellent mechanical performance, light‐weight, good electrical insulation, easy‐processing properties, excellent chemical resistance, and thermal stability 1–7 . However, with the fast development of modern electronic devices featuring high‐degree integration, miniaturization, and multi‐functionalization, such as, light emitting diodes arrays, flexible and wearable electronics, and three‐dimensional chip stack architectures, 8,9 much more unwanted heat will generate inside the devices simultaneously, making more difficult heat management and further reducing the service life of materials and even leading to thermal discomfort or thermal damage to skin 10,11 . The traditional polymer materials can no longer meet the requirements of modern science and technology any more, for most of them with poor thermal conductivities ranging from 0.1 to 0.20 Wm −1 K −1 8 .…”

Section: Introductionmentioning

confidence: 99%

Self‐healable and reprocessible liquid crystalline elastomer and its highly thermal conductive composites by incorporating graphene via in‐situ polymerization

Qian

Chen

et al. 2020

J of Applied Polymer Sci

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The booming of modern electronic devices featuring increasing power and multi-functionalization demands novel high thermal conductive materials with various functions, such as self-healing property and high deformability, while traditional polymer-based or metallic-based materials could hardly provide. Therefore, we report a high thermal conductive and disulfide-based selfhealable and reprocessible liquid crystalline elastomer (SHLCE) composite by incorporating graphene nanoplates (GNPs) fillers. The obtained GNPs/SHLCE composites exhibited desired thermal conductivity (5.08 Wm −1 K −1) when the content of GNPs was 20 wt% to the composites. Moreover, the GNPs/SHLCE composites showed intriguing recycled performance (Tensile strength after recycle could maintain over 93% compared with that of original composites). Furthermore, we concluded that the improved thermal conductivity of GNPs/ SHLCE composites was beneficial to the thermal induced reprocessible and shelf-healable systems.

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Composite Materials: Functional Soft Composites As Thermal Protecting Substrates for Wearable Electronics (Adv. Funct. Mater. 45/2019)

Cited by 9 publications

References 0 publications

Heat Capacity and Thermal Damping Properties of Spin‐Crossover Molecules: A New Look at an Old Topic

Heat Capacity and Thermal Damping Properties of Spin‐Crossover Molecules: A New Look at an Old Topic

A High-Performance Structural Supercapacitor

Self‐healable and reprocessible liquid crystalline elastomer and its highly thermal conductive composites by incorporating graphene via in‐situ polymerization

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