1985
DOI: 10.1143/jjap.24.l905
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Composition Dependence of Equal Thickness Fringes in an Electron Microscope Image of GaAs/AlxGa1-x As Multilayer Structure

Abstract: A new method is presented for the composition analysis of GaAs/Al x Ga1-x As multilayer structure using transmission electron microscopy. It is found that the position of equal thickness fringe observed at the edge of a cleaved chip is closely related to the composition. Change in Al composition in GaAs/Al x Ga1-x As superstructure is observed as a shift of the equal thickness fringe. Compositional… Show more

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Cited by 95 publications
(7 citation statements)
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“…The cleavage technique was first established for GaAs/GaAlAs [53]. The sample wafer is polished to about 200pm thickness and then cleaved into small squares 0.5mm x 1 mm in size.…”
Section: Sample Preparation From Bulk Materials By the Cleavage Techniquementioning
confidence: 99%
“…The cleavage technique was first established for GaAs/GaAlAs [53]. The sample wafer is polished to about 200pm thickness and then cleaved into small squares 0.5mm x 1 mm in size.…”
Section: Sample Preparation From Bulk Materials By the Cleavage Techniquementioning
confidence: 99%
“…23 The most promising TEM method to measure the composition at a nm resolution seems to be the thickness-fringe method. 24 This technique compares brightfield extinction fringes in a sample containing a 90-degree wedge with results of theoretical calculations. The fringe positions are very sensitive to compositional variation.…”
Section: Tem Characterizationmentioning
confidence: 99%
“…A variety of methods have been developed for the preparation of thin foil specimens from these materials (Brown and Sheng, 1988;Goodhew, 1985a; Newcomb et al, 1985). These have varied from methods involving either ion milling (Abrahams and Buiocchi, 1974;Bravman and Sinclair, 1984) or chemical etching (Chu and Sheng, 1984) to methods employing electron beam lithographic techniques (Dobisz et al, 1984;Wetzel and Danner, 1988) and to methods just involving mechanical cleaving (Hetherington, 1988; Kakibayashi and Nagata, 1985). This paper is concerned with the application of ion milling to obtain uniform cross-sectional specimens from (1nGa)AshGaAs multilayers.…”
Section: Introductionmentioning
confidence: 99%