“…Although it is generally known in the APT community that damage to the material can be limited by lowering the FIB accelerating voltage during the final "clean-up" step of, for instance, typical Cu/Co layers and Si materials (Larson et al, 1999;Thompson et al, 2006;Thompson et al, 2007), there is no clear consensus as to the optimal FIB conditions that should be employed for studying III-nitride materials in the ever increasing literature on these materials (Galtrey et al, 2007(Galtrey et al, , 2008Bennett et al, 2011;Prosa et al, 2011;Choi et al, 2012;Müller et al, 2012;Dawahre et al, 2013;Gu et al, 2013). Amidst these, variable "clean-up" FIB voltages, up to 5 kV, have been reported (Bennett et al, 2011;Gu et al, 2013). When investigating Gacontaining materials, this issue becomes challenging due to the question of differentiation of FIB-implanted Ga damage from Ga originally present in the sample.…”