Composition, mechanical properties, and structure of electrodeposited cobalt–iron alloys

Sadak, J. C.; Sautter, F. K.

doi:10.1116/1.1312750

Cited by 7 publications

(7 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Various metal and alloy films such as Ni, In, Cu, Au and NiFe, NiP, CoFe have been formed by electrodeposition. [1][2][3] A combination of photolithography technology and electrodeposition ͑so-called through-mask plating 4 ͒ makes it possible to fabricate microstructures suitable for microsensors and microactuators. [5][6][7] However, one of the problems associated with electrodeposition is the uniformity control of the electroplated films both in thickness and composition.…”

mentioning

confidence: 99%

Uniformity Control of Ni Thin-Film Microstructures Deposited by Through-Mask Plating

Luo¹,

Chu²,

Flewitt³

et al. 2005

J. Electrochem. Soc.

View full text Add to dashboard Cite

The thickness uniformity within a specimen and the cross-sectional profiles of electroplated individual Ni microstructures have been investigated as a function of the electroplating conditions. It was found that the uniformity and profiles of microstructures could be controlled by varying the process conditions. A uniform thickness distribution and microstructures with flat profiles could be obtained at optimal plating conditions of 8 mA/cm 2 and 60°C. Above this optimal plating current density, the microstructure has a rabbit-ears profile, and the thickness of a narrow microstructure is thicker than that of wide ones. Below this current density, the microstructure has a cap-like cross-sectional profile, and a narrow structure is thinner than wide ones. Increasing the plating temperature enhances the nonuniformity, whereas other process parameters have insignificant effects on it. The current crowding observed in patterned specimens is responsible for the rabbit-ears profile of individual microstructures, while a combination of the fluidic friction on the sidewall of the photoresist and the electrophoresis of the ions in the solution are believed to be responsible for the abnormal cap-like profile of individual microstructures and the thinning effect on narrow microstructures.Electrodeposition ͑or electroplating͒ has become one of the most important technologies for microelectronics and microelectromechanical systems ͑MEMS͒, as it produces high-quality metal films in a simple way at a low cost. Various metal and alloy films such as Ni, In, Cu, Au and NiFe, NiP, CoFe have been formed by electrodeposition. 1-3 A combination of photolithography technology and electrodeposition ͑so-called through-mask plating 4 ͒ makes it possible to fabricate microstructures suitable for microsensors and microactuators. 5-7 However, one of the problems associated with electrodeposition is the uniformity control of the electroplated films both in thickness and composition. 8,9 This affects the material properties and resulting performance of microcomponents.The thickness uniformity of electroplated metal films was intensively studied during the 1990s, especially for the microelectronics industry as Cu became the standard for interconnects in integrated circuits and also for the MEMS society as plated metal microstructures became popular microcomponents for sensors and actuators. The thickness variation of a Cu film on a Si wafer typically has a ''rabbit-ears'' shape distribution ͑it is also called a nodule shape͒, i.e., it is thinner in the center of the wafer and becomes thicker toward the edge. 9,10 The ''resistive seed layer'' model has been developed to explain the thickness variation on the wafer which is due to the voltage drop from the edge terminal contact to the center of a wafer. 9,10 For patterned wafer plating, the uniformity has an effect not only on the thickness variation across a wafer but also on the thickness of the individual microstructures, which develop rabbitears ͑or nodule͒ cross-sectional profiles. 11 The ''a...

show abstract

mentioning

confidence: 99%

Uniformity Control of Ni Thin-Film Microstructures Deposited by Through-Mask Plating

Luo¹,

Chu²,

Flewitt³

et al. 2005

J. Electrochem. Soc.

View full text Add to dashboard Cite

show abstract

“…This becomes fine-grained with increasing the current density [13,14,18]. The fine-grained structure has been attributed to the low Young's modulus of 93 GPa, while the columnar structure of Ni corresponded to a high Young's modulus of 182 GPa [18].…”

mentioning

confidence: 95%

“…However, the resulting device performance after fabrication can be very different from the predicted performance due to a dependence of the properties of plated thin metals upon processing. This leads to the redesign and re-fabrication of MEMS devices, increasing the development time and cost.It is known that the microstructure and mechanical properties of a plated thin film depend upon the plating conditions such as temperature, concentration and current density [2,[11][12][13][14]. Surprisingly, little effort has been made to clarify the relationship between processing conditions and mechanical properties of plated thin metal films, particularly of plated Ni.…”

mentioning

confidence: 99%

“…It is known that the microstructure and mechanical properties of a plated thin film depend upon the plating conditions such as temperature, concentration and current density [2,[11][12][13][14]. Surprisingly, little effort has been made to clarify the relationship between processing conditions and mechanical properties of plated thin metal films, particularly of plated Ni.…”

mentioning

confidence: 99%

See 1 more Smart Citation

Young's modulus of electroplated Ni thin film for MEMS applications

et al. 2004

View full text Add to dashboard Cite

“…The electrodeposition of cobalt, dispersion-hardened cobalt, and cobalt-based alloys has been the subject of investigation (1)(2)(3)(4)(5)(6) at this laboratory for many years because of the potential application as protective coatings to improve the wear and erosion characteristics of the substrates. In conventional cobalt plating, soluble anodes are used to replenish the metal deposited at the cathode.…”

mentioning

confidence: 99%

Electrodeposition of Cobalt Using an Insoluble Anode

Lakshminarayanan

Chen

Sadak

et al. 1976

J. Electrochem. Soc.

View full text Add to dashboard Cite

A method has been developed which permits the use of an insoluble anode to electrodeposit cobalt by the addition of a sufficient amount of an electrochemically active substance such as vanadium pentoxide to the cobalt sulfate plating solution. In the absence of such additions, formation of Co3+ ions and cobalt oxide false(Co2O3false) at the platinum anode results during plating. The effects of the addition of vanadium pentoxide on the electrode process during plating have been investigated through the analyses of various electrolysis products as a function of additive concentration and plating time. The results show that besides cobalt deposition, vanadium ions of lower oxidation state (V++, V+++, VO++ ) are formed at the cathode and these ions seem to be responsible for the reduction and suppression of Co3+ ions and the oxide at the platinum anode. It has also been observed that the concentration of the added electrochemically active substance changed very little, indicating no incorporation of vanadium with the deposit during plating. The mechanical properties of the deposits prepared using an insoluble anode are compared with those obtained using a soluble anode.

show abstract

Composition, mechanical properties, and structure of electrodeposited cobalt–iron alloys

Cited by 7 publications

References 1 publication

Uniformity Control of Ni Thin-Film Microstructures Deposited by Through-Mask Plating

Uniformity Control of Ni Thin-Film Microstructures Deposited by Through-Mask Plating

Young's modulus of electroplated Ni thin film for MEMS applications

Electrodeposition of Cobalt Using an Insoluble Anode

Contact Info

Product

Resources

About