Young's modulus of electroplated Ni thin film for MEMS applications

Luo, Jiapeng; Flewitt, Andrew J.; Spearing, S. Mark; Fleck, N.A.; Milne, W. I.

doi:10.1016/j.matlet.2004.02.044

Cited by 105 publications

(24 citation statements)

References 15 publications

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“…It is assumed that this decrease is due to the increase in coating porosity. The variation of Young's modulus with respect to the plating conditions is of high importance when designing and manufacturing MEMS devices based on plating technologies such as LIGA [85]. The average values of the modulus of elasticity obtained with more test methods had values between 135 and 219 for SCS/SDB and between 155 and 183 GPa for SCS/Epi.…”

Section: Thin Film Nano-mechanical Propertiesmentioning

confidence: 99%

AFM Nanotribomechanical Characterization of Thin Films for MEMS Applications

et al. 2021

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Nanotribological studies of thin films are needed to develop a fundamental understanding of the phenomena that occur to the interface surfaces that come in contact at the micro and nanoscale and to study the interfacial phenomena that occur in microelectromechanical systems (MEMS/NEMS) and other applications. Atomic force microscopy (AFM) has been shown to be an instrument capable of investigating the nanomechanical behavior of many surfaces, including thin films. The measurements of tribo-mechanical behavior for MEMS materials are essential when it comes to designing and evaluating MEMS devices. A great deal of research has been conducted to evaluate the efficiency and reliability of different measurements methods for mechanical properties of MEMS material; nevertheless, the technologies regarding manufacturing and testing MEMS materials are not fully developed. The objectivesof this study are to focus on the review of the mechanical and tribological advantages of thin film and to highlight the experimental results of some thin films to obtain quantitative analyses, the elastic/plastic response and the nanotribological behavior. The slight fluctuation of the results for common thin-film materials is most likely due to the lack of international standardization for MEMS materials and for the methods used to measure their properties.

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Section: Thin Film Nano-mechanical Propertiesmentioning

confidence: 99%

AFM Nanotribomechanical Characterization of Thin Films for MEMS Applications

et al. 2021

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“…The mechanical behaviour of the electroplated nickel might be very different from the behaviour of standard metallurgic sheet nickel, as its behaviour is very dependent on the bath and process conditions. The Young's modulus is very dependent on the bath type, and for a sulfamate bath as used in the experiments a value of E = 100 GPa has been obtained in literature [16]. Hardness measurements of the plated nickel foils were performed and showed to be between 250 -300 HV, which is within the range of metallurgic nickel sheets [17].…”

Section: Applicationmentioning

confidence: 99%

Modelling the deformation of nickel foil during manufacturing of nanostructures on injection moulding tool inserts

Sonne¹,

Čech

Pranov³

et al. 2016

AIP Conference Proceedings

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In the present work, a manufacturing process for transferring nanostructures from a glass wafer, to a double-curved insert for injection moulding is demonstrated. A nanostructure consisting of sinusoidal cross-gratings with a period of 426 nm is successfully transferred to hemispheres on an aluminium substrate with three different radii; 500 μm, 1000 μm and 2000 μm, respectively. The nanoimprint is performed using a 50 μm thick nickel foil, manufactured using electroforming. During the imprinting process, the nickel foil is stretched due to the curved surface of the aluminium substrate. Experimentally, it is possible to address this stretch by counting the periods of the cross-gratings via SEM characterization. A model for the deformation of the nickel foil during nanoimprint is developed, utilizing non-linear material and geometrical behaviour. Good agreement between measured and numerically calculated stretch ratios on the surface of the deformed nickel foil is found, and it is shown, that from the model it is also possible to predict the geometrical extend of the nanostructured area on the curved surfaces.

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“…To estimate the fatigue failure of the copper plating base, the Coffin-Manson relationship of the form [19] has been adopted:…”

Section: Coffin-manson Rulementioning

confidence: 99%

“…The ductility (ε f ) of copper is smaller than the ductility of bulk copper [20][21][22][23]. Thus, in this study a ductility of 20% [19] has been assumed. Reliable strain changes in the Coffin-Manson rule can be obtained from multiple thermal cycles calculations since the metal layers undergo complex plastic deformation.…”

Section: Coffin-manson Rulementioning

confidence: 99%

Damage assessment in multilayered MEMS structures under thermal fatigue

Maligno

Whalley

Silberschmidt

2011

J. Phys.: Conf. Ser.

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This paper reports on the application of a Physics of Failure (PoF) methodology to assessing the reliability of a micro electro mechanical system (MEMS). Numerical simulations, based on the finite element method (FEM) using a sub-domain approach was used to examine the damage onset due to temperature variations (e.g. yielding of metals which may lead to thermal fatigue). In this work remeshing techniques were employed in order to develop a damage tolerance approach based on the assumption that initial flaws exist in the multi-layered. IntroductionPhysics of Failure (PoF) methodologies have become well established tools for evaluating the risks of failure in electronics [1]. The Polynoe Programme is committed at improving the understanding, the modelling and the prediction of the reliability of DC MEMS switches through a PoF approach [1]. Typical failure modes observed in MEMS devices and their packages include fatigue, interface delamination, and die cracking. In particular, delamination can cause shorting or mechanical impedance [2]. This research aims, firstly, to understand the effects of temperature variations as a possible cause of damage, such as yielding in the metal layers, and subsequent failure (e.g. interfacial delamination, fracture) in multilayered MEMS packages. The particular MEMS considered in this work are DC MEMS switches, but the methodology is applicable to a range of devices manufactured using similar technology. However, the construction of full-scale finite element models of MEMS devices such as DC switches which are detailed enough to accurately resolve the stresses within each region of the model is difficult due to their complex geometry. Hence, an accurate determination of local stresses can be achieved by the use of a sub-domain or representative volume element (RVE) in which the effect of the global stress/strain field at the local micro-structural scale of the device can be computed more accurately [3]. The sub-domain adopted in this study is three-dimensional (3D) which allows the determination of accurate and realistic tri-axial stress/strain fields within the FE model. This methodology consents to a detailed understanding of the effects of thermal loading conditions on the stress/strain distribution at micro-structural level and in particular near the materials interfaces [4,5]. The second part of this study aims to simulate the delamination in metal layers caused by high stress gradients. In fact, the high stress gradients, due to the material mismatch, might lead to inter-layer damage with the presence of cracks. In this paper a conceptual model is presented for a software framework, based on the remeshing tool Zencrack combined with FE code ABAQUS [6], which allows efficient and automatic simulation of non-planar 3D crack propagation.

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Young's modulus of electroplated Ni thin film for MEMS applications

Cited by 105 publications

References 15 publications

AFM Nanotribomechanical Characterization of Thin Films for MEMS Applications

AFM Nanotribomechanical Characterization of Thin Films for MEMS Applications

Modelling the deformation of nickel foil during manufacturing of nanostructures on injection moulding tool inserts

Damage assessment in multilayered MEMS structures under thermal fatigue

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