Computational analysis and experimental evidence of two typical levelers for acid copper electroplating

Lai, Zhiqiang; Wang, Shouxu; Wang, Chong; Yan, Hong; Chen, Yuanming; Zhang, Huaiwu; Zhou, Guoyun; He, Wei; Ai, Kehua; Peng, Yongqiang

doi:10.1016/j.electacta.2018.04.062

Cited by 72 publications

(28 citation statements)

References 32 publications

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“…According to previous research, high electron density regions (e. g., N=N of JGB) have strong coordination and adsorption capability to the copper surface. [13] This region could offer electrons to the lowenergy empty molecular orbitals of copper to form a coordinate/covalent bond, [15,52] which indicated that the carbonyl region of 1 e was the probable adsorption site for the adsorption of 1 e on the copper surface.…”

Section: Resultsmentioning

confidence: 99%

“…[13,14] Recent studies showed that JGB only had an antagonistic effect with SPS, which will result in the thin knee, at high current density electroplating. [15] The quaternary ammonium salts, being proved as effective levelling agent, have been widely reported. [11,[16][17][18] During the electrodeposition process, the cationic quaternary ammoniums ionized in aqueous solution could easily reach to the cathode surface and adsorb to suppress copper electrodeposition process.…”

Section: Introductionmentioning

confidence: 99%

“…Typical dyestuff leveler such as Janus Green B (JGB), has been extensively was copper electroplating industry, but the existence of the JGB molecules will cause instability of the electrolyte . Recent studies showed that JGB only had an antagonistic effect with SPS, which will result in the thin knee, at high current density electroplating …”

Section: Introductionmentioning

confidence: 99%

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Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Zhao

et al. 2019

ChemElectroChem

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A series of fatty acid quaternary ammonium surfactants (FAQAS 1 a–1 f) derived from renewable resource of fatty acid have been rationally designed and investigated as levelers applied in copper electroplating. Surface tension and contact angle indicated the FAQAS's surfactivity and wettability were closely related to the length of hydrophobic chains. FAQAS 1 a–1 f displayed the capability to inhibit the copper deposition in CV tests and their inhibiting abilities agreed with the order of their surfactivity and wettability. Compound 1 e showed the best inhibition capability, and was comprehensively tested by field‐emission scanning electron microscopy (FE‐SEM), X‐ray photoelectron spectroscopy (XPS) and other electrochemical measurements. The strong inhibition ability of compound 1 e on copper electrodeposition could be attributed to its fast and strong absorption of 1 e on the cathode surface. Moreover, galvanostatic measurements (GMs) indicated that compound 1 e not only cause polarization but also has stable synergistic effects with other additives to form a convection dependent competitive adsorption layer. In addition, through‐hole (TH) electroplating experiments verified that uniform TH could be obtained on copper electrodeposition using the bath containing compound 1 e. This work may shed some light on the pratical application of surfactants as effective leveler in acid copper electroplating.

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Zhao

et al. 2019

ChemElectroChem

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“…Geometry optimizations were carried out by density functional theory (DFT) using B3LYP functional with the 6-311G+(d.p) basis set. 44 The frontier molecular orbital energies and energy gap of PBDGE were calculated and considered. These parameters were used to further elaborate the mechanism of interaction between PBDGE and copper surface.…”

Section: ■ Methodsmentioning

confidence: 99%

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Zhou

Yan

et al. 2020

ACS Omega

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A copolymer comprising of pyrrole and 1,4-butanediol diglycidyl ether (PBDGE) was designed and synthesized as a leveler to improve the throwing power for printed circuit board (PCB) through-hole electroplating. The results of linear sweep voltammetry (LSV), galvanostatic measurements (GMs), and cyclic voltammetry (CV) reveal the strong coordination effect of PBDGE with other additives and confirm the advantageous performance of PBDGE to effectively assist the electroplating of through-hole. An increment of 35.5% in the throwing power was achieved under the addition of PBDGE in through-hole plating. Additionally, the reaction mechanism was studied by quantum chemical calculations and molecular dynamics (MD) simulations, indicating that the pyrrole rings of the PBDGE molecule are adsorbed on the copper surface as the adsorption sites to balance the copper plating regardless of the through-hole position differences.

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“…Electroplating is another common method for realizing the metallization of insulating surface meanwhile thickening the conductive patterns . Electroplating has become the most important step in the fabrication process of electronic components, printed circuit boards, and semiconductor industries due to its inherently low cost, high-throughput, and high stability. − However, compared with metal surface, the polymers have a very low surface energy, leading to a low wettability of the plating solution on the polymer substrates. , Consequently, the plated metal film on the polymer is scattered and irregular with poor surface coverage. Furthermore, the interfacial adhesion of metal/polymer composites decreases with the increase of the thickness of the plated films due to the different atomic arrangements of the two adjacent layers .…”

Section: Introductionmentioning

confidence: 99%

Directly Electroplated Metallization on Flexible Substrates Based on Silver Nanowire Conductive Composite for Wearable Electronics

Lai

Zhao

Zhu

et al. 2021

ACS Appl. Nano Mater.

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The metallization of flexible polymer surface is a necessary process to realize the electrical interconnection of insulating substrates, which is of great significance for the fabrication of flexible wearable electronics. Herein, a method for the fabrication of a metal/ polymer composite is presented on the basis of a silver nanowire (AgNW) conductive composite by direct copper electroplating. A precoating was first coated on the polyethylene terephthalate (PET) substrate to form the interspace structures on the surface. AgNWs could just be embedded into these interspace structures by the means of coating to obtain excellent adhesion. Furthermore, these interspace structures were filled with deposited copper atoms, thus contributing to a strong interlock between the plated copper layer and the substrate. The obtained Cu/PET composites were subjected to morphological and mechanical characterizations to analyze the peeling strength, crystalline structure, and surface morphology of the plated copper layer. Experimental results show that the plated copper layer is dense and consistent with a maximum peel strength of 11 N cm −1 . In addition, large scale of the Cu/PET (20 cm × 30 cm) composite with a thickness of 21 μm was fabricated by this method, and copper patterns were further fabricated using a conventional etching process. The fabricated copper patterns exhibit an outstanding electrical stability after 3000 times of a bending fatigue test, proving the excellent flexibility of the Cu/PET composite. In conclusion, this approach provides an insight into the design of metal/ polymer composites addressing a significant potential application in flexible printed circuit, electrode, and antenna for wearable electronics.

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Computational analysis and experimental evidence of two typical levelers for acid copper electroplating

Cited by 72 publications

References 32 publications

Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Fatty Acid Quaternary Ammonium Surfactants Based on Renewable Resources as a Leveler for Copper Electroplating

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Directly Electroplated Metallization on Flexible Substrates Based on Silver Nanowire Conductive Composite for Wearable Electronics

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