Computational analysis of new microchannel heat sink configurations

Convective heat transfer of Cu–water nanofluid in a cylindrical microchannel heat sink

“…Such information include, but not limited to, detailed experimental measurements and theoretical predictions of the local and average heat sink temperature, heat flux, and Nusselt number [1]. Several studies of MCHS have been published which can be grouped as analytical [3][4][5][6][7], numerical [8][9][10][11][12][13], and experimental [14][15][16][17][18]. However, as demonstrated by several researchers [19][20][21], resultant findings remain inconclusive, especially when experimental and theoretical results are compared.…”

Optimization of thermal resistance and bottom wall temperature uniformity for double-layered microchannel heat sink

“…When the heat flux reaches up to 100 W cm À2 , the conventional cooling technology is failed to meet the requirement of thermal removal as expected. Fortunately, the microchannel heat sink (MCHS) proposed by Tuckerman and Pease [1] in 1981 can endure a heat flux as high as 790 W cm À2 , which becomes a significant way for thermal management of microelectronic devices and attracts a great deal of attention [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17][18][19][20].…”

Numerical investigation of heat transfer enhancement in wavy microchannel with tangential branched secondary channels

“…All of them observed an increase in the heat transfer performance. Leela et al numerically investigated the fluid flow and heat transfer characteristics of a newly designed MC heat sink. They reported that, at the same heat flux and pumping power, the new design has higher heat transfer, lower temperature gradient of the substrate, and lower total thermal resistance than conventional MC heat sink.…”