Computational simulation of underfill encapsulation of flip-chip ICs. I. Flow modeling and surface-tension effects

Yang, Hong; Bayyuk, Sami; Krishnan, Anantha; Przekwas, Andrzej; Nguyen, Luu; Fine, P.

doi:10.1109/ectc.1998.678912

Cited by 7 publications

(6 citation statements)

References 5 publications

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“…A new reactive flow simulation software, plastic integrated circuit encapsulation-computer aided design (PLICE-CAD) [4], [5], is used to model the underfill flow front. Both experimental and simulated results are presented and discussed.…”

mentioning

confidence: 99%

Underfill of flip chip on laminates: simulation and validation

Nguyen

Quentin

Fine

et al. 1999

IEEE Trans. Comp. Packag. Technol.

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The flow characteristics of a number of underfills were evaluated with quartz dies of different patterns and pitches bonded on different substrate surfaces. Perimeter, mixed array, and full array patterns were tested. Observations on the flow front uniformity, streaking, voiding, and filler segregation were collected. The information was compared with the results predicted by a new simulation code, plastic integrated circuit encapsulationcomputer aided design (PLICE-CAD) under DARPA-funded development. The two-phase model of the combined resin and air takes into account geometrical factors such as bumps and die edges, together with boundary conditions in order to track accurately the propagation of the flow fronts. The two-phase flow field is based on the volume-of-fluid (VOF) methodology embedded in a general-purpose three-dimensional (3-D) flow solver. Index Terms-Capillary flow, filler settling, flip chip, flow simulation, flow streaking, full array pattern, mixed array pattern, organic laminates, peripheral pattern, quartz dies, underfill flow.

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mentioning

confidence: 99%

Underfill of flip chip on laminates: simulation and validation

Nguyen

Quentin

Fine

et al. 1999

IEEE Trans. Comp. Packag. Technol.

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“…The limitations of the 2D geometry will be discussed in the Results section. This specific treatment of the VOF method has been validated elsewhere (Yang et al 1998) against analytical expressions for capillary rise in a circular tube, Laplace pressure in bubbles and surface tension driven channel flow. Several different grid resolutions were considered in order to find the optimum balance of accuracy and computational time.…”

Section: Methodsmentioning

confidence: 99%

“…This leads to the following expression, which is presented in dimensional form for clarity (Yang et al 1998…”

Section: Methodsmentioning

confidence: 99%

Computational fluid dynamics analysis of microbubble formation in microfluidic flow-focusing devices

Weber

Shandas

2006

Microfluid Nanofluid

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Bubble formation in a microfluidic flowfocusing device is simulated using the volume-of-fluid approach to achieve a complete solution of the NavierStokes equations for both the gas and liquid phases. The results of the simulation show good agreement with previous experimental results. A detailed examination of the predicted pressure and velocity profiles from the simulation also provide further validation for the conclusions drawn previously with experimental results. The simulation results show the existence of two distinct modes of bubble formation. Simulations of systems an order of magnitude smaller than those investigated experimentally indicate that such reduced systems sizes are a viable approach that would result in much smaller bubble sizes.

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“…To solve these problems, fully three-dimensional simulation is required. Although some studies about the threedimensional simulation have been reported [7][8][9], some important factors have not been taken into account comprehensively, e.g., the non-isothermal effect and the cure of the encapsulant. An integrated three-dimensional simulation approach involving most important factors is still in need.…”

Section: Introductionmentioning

confidence: 99%

“…In the approach, the power-law constitutive equation was used and the time-dependent velocity boundary condition was applied. Yang et al [7] performed the three-dimensional flow simulation of the underfill process using the finite-volume based semi-implicit pressure-linked equations (SIMPLE) algorithm. The volume-offluid (VOF) method was employed to track the melt-front.…”

Section: Introductionmentioning

confidence: 99%