Computationally efficient power integrity simulation for system-on-package applications

Abstract

Power integrity simulation for system-on-package (SoP) based modules is a crucial bottleneck in the SoP design flow. In this paper, the multi-layer finite difference method (M-FDM) augmented with models for split planes has been proposed as a fast and accurate frequency domain engine. Results demonstrating the accuracy and scalability of the method have been presented. In particular, the algorithm was employed to the analysis of a realistic 6 layer package with ∼ 200k nodes.

A GTLE and FDFD algorithm for analysis of power integrity in PCBs and packages

“…In effect, this model represents the voltage-current relationship in the impedance that describes the capacitor. The resulting equation for a given impedance location is given by V2V(r)+eV(r)= dc V(r) o (r-rs)+g]z o (r-r e ) (6) Zs(m)A Where ZsC w ) is the total impedance of the SMDs, rs is its location, and Ais the area of the FDFD grid cell. Eq.…”