Computer Simulation of Platelet Adhesion around Stent Struts in the Presence and Absence of Tissue Defects around Them

Kawamura, Yota; Tamura, Noriko; Goto, Shinichi; Goto, Shinya

doi:10.1155/2021/8880988

Cited by 3 publications

(2 citation statements)

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“…Studies have found that, as assessed by optical coherence tomography (OCT), stent malapposition (lack of contact between a stent strut and the intimal surface), neoatherosclerosis, uncovered struts and stent under-expansion were all higher in patients with LST and VLST [137]. Commonly, the underlying cause of LST and VLST was found to be due to multiple factors, with malapposition alongside uncovered struts being the most common, the precise mechanisms of which are not yet well understood but may be due to the tissue defect surrounding the uncovered struts [138]. However, plaque rupture and occlusive restenosis have been found to contribute [137,139].…”

Section: Thrombosismentioning

confidence: 98%

The Mechanisms of Restenosis and Relevance to Next Generation Stent Design

et al. 2022

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Stents are lifesaving mechanical devices that re-establish essential blood flow to the coronary circulation after significant vessel occlusion due to coronary vessel disease or thrombolytic blockade. Improvements in stent surface engineering over the last 20 years have seen significant reductions in complications arising due to restenosis and thrombosis. However, under certain conditions such as diabetes mellitus (DM), the incidence of stent-mediated complications remains 2–4-fold higher than seen in non-diabetic patients. The stents with the largest market share are designed to target the mechanisms behind neointimal hyperplasia (NIH) through anti-proliferative drugs that prevent the formation of a neointima by halting the cell cycle of vascular smooth muscle cells (VSMCs). Thrombosis is treated through dual anti-platelet therapy (DAPT), which is the continual use of aspirin and a P2Y12 inhibitor for 6–12 months. While the most common stents currently in use are reasonably effective at treating these complications, there is still significant room for improvement. Recently, inflammation and redox stress have been identified as major contributing factors that increase the risk of stent-related complications following percutaneous coronary intervention (PCI). The aim of this review is to examine the mechanisms behind inflammation and redox stress through the lens of PCI and its complications and to establish whether tailored targeting of these key mechanistic pathways offers improved outcomes for patients, particularly those where stent placement remains vulnerable to complications. In summary, our review highlights the most recent and promising research being undertaken in understanding the mechanisms of redox biology and inflammation in the context of stent design. We emphasize the benefits of a targeted mechanistic approach to decrease all-cause mortality, even in patients with diabetes.

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Section: Thrombosismentioning

confidence: 98%

The Mechanisms of Restenosis and Relevance to Next Generation Stent Design

et al. 2022

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“…In addition, the effect of surface roughness on the initial adhesion of S690 low-alloy steel and epoxy-amine adhesive was studied by Van et al [16], the test results showed that the improved adhesion is mainly attributed to the increased surface area at higher surface roughness. Kawamura et al [17] investigated a higher rate of platelet adhesion in the presence of tissue defects around stent struts by computer simulation. Thus, the effect of defects on adhesion properties can't be ignored.…”

Section: Introductionmentioning

confidence: 99%

Nonmonotonic dependence of adhesion between liquid aluminum and silicon surface on the temperature of the surface

Liu,

Rui,

Huang

et al. 2023

Phys. Scr.

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In this paper, the effect of temperature on the adhesion properties between liquid aluminum (Al) and solid silicon (Si) in the presence and absence of vacancy defects is elucidated. Firstly, the perfect defect-free and vacancy defect models consist of crystalline Al probe and Si substrate are established by classical molecular dynamics simulation method. Then, the melting and adhesion process of probe Al are simulated, and the adhesion performance and microscopic permeation evolution of liquid Al/solid Si are analyzed. The results show that the adhesion force changes nonmonotonically with increasing substrate temperature T without vacancy defects. Specifically, when the substrate temperature varies at relatively low values smaller than the melting point of Al, that is, 100 K < T < 933 K, the thermal excitation provides more energy to the substrate Si atoms, which intensifies the aggregation of the substrate atoms, makes the interfacial atoms more dense and the number of atoms permeating into the substrate decreases, resulting in a decrease in adhesion force. On the contrary, when 933 K < T < 1500 K, due to the thermal effect, higher temperatures intensify the thermal vibration of the substrate atoms, resulting in violent collisions between the interfacial atoms, and the space for free movement increases, thus making the distance between the atoms larger. And the number of Al atoms permeating into the substrate Si increases, leading to an increase in interfacial adhesion. Furthermore, the adhesion force shows an upward trend with the elevated temperature in the presence of vacancy defects at low temperatures, this is attributed to the fact that more atoms are broken away from the equilibrium lattice structure, and the number of permeating atoms increases by increasing temperature. In particular, the interfacial adhesion is the largest when the vacancy defects of the substrate are the most serious.

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