Facing the explosive growth of heat
flux in microelectronic equipment,
advanced thermal management materials should not only ensure the safe
and stable operation of equipment, but also have the ability to withstand
fire risks. Carbon materials such as graphene are subject to many
restrictions in use due to their inherent high conductivity. Hexagonal
boron nitride (h-BN) is often used to blend with polymers to prepare
flexible thermal management materials due to its excellent electrical
insulation and thermal conductivity. However, its further application
is limited by its insufficient flame resistance and limited improvement
of thermal conductivity at low filling levels. In this paper, urea-assisted
ball milling is used to achieve the amination of boron nitride nanosheets
(BNNS) and black phosphorus (BP), which creates the covalent bond
between the filler and the cellulose. With the overlapping between
small-size BP and large-size BNNS, the thermal conductivity, flame
resistance, and mechanical properties of the film are significantly
enhanced. Accordingly, the cellulose nanofiber (CNF)-based film has
a high thermal conductivity of 42.29 W m–1 K–1 at 50 wt % loading (40 wt % BNNS-NH2 and
10 wt % BP-NH2), which is 777% higher than that of pure
CNF. In addition, the peak heat release rate and total heat release
of CBP10 decrease by 80.3 and 64.7%, respectively, compared with pure
CNF, and the residue is more complete and denser, indicating that
the film can effectively reduce and delay the fire hazard.