2016
DOI: 10.1088/0268-1242/31/11/113001
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Conductive bridging random access memory—materials, devices and applications

Abstract: We present a review and primer on the subject of conductive bridging random access memory (CBRAM), a metal ion-based resistive switching technology, in the context of current research and the near-term requirements of the electronics industry in ultra-low energy devices and new computing paradigms. We include extensive discussions of the materials involved, the underlying physics and electrochemistry, the critical roles of ion transport and electrode reactions in conducting filament formation and device switch… Show more

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Cited by 101 publications
(78 citation statements)
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“…Since the filament rupture is actually a field‐assisted thermal diffusion process, temperature influences the rate of redox reaction. The I RESET can be expressed asIRESET Enormalaβq + knormalbTβq ln Acnc0where E a , β, and q are activation energy for cation hopping, dimensionless correction factor, and elementary charge, respectively. k b is Boltzmann constant, T is temperature, c n is cation concentration out of CF, and c 0 is cation concentration within CF.…”
Section: Resultsmentioning
confidence: 99%
“…Since the filament rupture is actually a field‐assisted thermal diffusion process, temperature influences the rate of redox reaction. The I RESET can be expressed asIRESET Enormalaβq + knormalbTβq ln Acnc0where E a , β, and q are activation energy for cation hopping, dimensionless correction factor, and elementary charge, respectively. k b is Boltzmann constant, T is temperature, c n is cation concentration out of CF, and c 0 is cation concentration within CF.…”
Section: Resultsmentioning
confidence: 99%
“…Under bias, mobile cations, such as Ag + or Cu 2+ , are transported through the interstitials of a solid electrolyte (usually a chalcogenide) forming and dissolving metallic filaments via redox reactions at the electrodes. Typical diffusivities range around 10 −4 –10 −7 cm 2 s −1 in Cu 2–α S electrolyte films, which result in low switching currents under applied voltages . Both classes of memristive devices rely on filament formation, a highly complex process still under investigation.…”
mentioning
confidence: 99%
“…Typical diffusivities range around 10 −4 -10 −7 cm 2 s −1 [26] in Cu 2-α S electrolyte films, which result in low switching currents under applied voltages. [27][28][29][30] Both classes of memristive devices rely on filament formation, a highly complex process still under investigation. Although empirical operation protocols have been devised for voltage and current versus time, it is difficult to predict the size and number of formed filaments, which hinders reversibility, accuracy and symmetry.…”
mentioning
confidence: 99%
“…Two resistance transitions can be noted by the current-voltage characteristics shown in Figure 11b, which evidence both the abrupt nature of the set process due to the positive feedback loop involving the two driving forces for ion migration, namely the electric field and temperature, and the more gradual dynamics of the reset process due to the negative feedback occurring within the device as a negative pulse is applied [66]. Similar to the bipolar RRAM described in Figure 11b, which typically relies on switching layers, including HfO x [67], TaO x [68], TiO x [69], SiO x [70], and WO x [71], the conductive-bridge random access memory (CBRAM), where metallic CFs are created/disrupted between active Cu/Ag electrodes, has also received strong interest in recent years [72]. In addition to bipolar RRAM concepts, another type of filamentary RRAM called unipolar RRAM, typically based on NiO [73][74][75], has been widely investigated, evidencing that pulses with the same polarity can induce both set and reset processes as a result of the key role played by Joule heating for the creation/disruption of CF [73,75].…”
Section: Memristive Devices With 2-terminal Structurementioning
confidence: 99%